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Proceedings Papers

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Edward Davis
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022
Paper No: IPACK2022-97433
DOI: https://doi.org/10.1115/IPACK2022-97433
View Paper titled, Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
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Topics: High temperature, Modeling, Reliability, Flip-chip, Solder joints, Ball-Grid-Array packaging, Electronics, Fatigue failure, Fatigue life, Materials degradation
Proceedings Papers

Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A017, October 26–28, 2021
Paper No: IPACK2021-74061
DOI: https://doi.org/10.1115/IPACK2021-74061
View Paper titled, Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage
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Topics: High temperature, Relaxation (Physics), Reliability, Storage, Temperature, Viscoelasticity, Electronics, Glass transition, Materials properties, Mechanical properties
Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Paper No: IPACK2019-6561
DOI: https://doi.org/10.1115/IPACK2019-6561
View Paper titled, Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties
Click here to open pdf in another window PDF for Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties
Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)
Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018
Paper No: IPACK2018-8345
DOI: https://doi.org/10.1115/IPACK2018-8345
View Paper titled, Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)
Click here to open pdf in another window PDF for Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)
Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design
Proceedings Papers

The Mechanism of the Low-K Stress Reduction in Chip Assembly by Shorter Solder Bump Height

Keiji Matsumoto, Keishi Okamoto, Hiroyuki Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, August 29–September 1, 2017
Paper No: IPACK2017-74097
DOI: https://doi.org/10.1115/IPACK2017-74097
View Paper titled, The Mechanism of the Low-K Stress Reduction in Chip Assembly by Shorter Solder Bump Height
Click here to open pdf in another window PDF for The Mechanism of the Low-K Stress Reduction in Chip Assembly by Shorter Solder Bump Height
Topics: Manufacturing, Solders, Stress, Delamination, Relaxation (Physics), Simulation
Proceedings Papers

Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Ruiyang Liu, HoHyung Lee, Seungbae Park, Xiaojie Xue
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A005, July 6–9, 2015
Paper No: IPACK2015-48086
DOI: https://doi.org/10.1115/IPACK2015-48086
View Paper titled, Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage
Click here to open pdf in another window PDF for Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage
Topics: Adhesives, Shrinkage (Materials), Storage, Finite element analysis, Sensors, Viscoelasticity, Epoxy adhesives, Epoxy resins, MEMS packaging, Microelectromechanical systems
Proceedings Papers

Validation Study for VOF Simulations of Boiling in a Microchannel

Catherine Gorlé, Hyoungsoon Lee, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A022, July 6–9, 2015
Paper No: IPACK2015-48129
DOI: https://doi.org/10.1115/IPACK2015-48129
View Paper titled, Validation Study for VOF Simulations of Boiling in a Microchannel
Click here to open pdf in another window PDF for Validation Study for VOF Simulations of Boiling in a Microchannel
Topics: Boiling, Microchannels, Simulation, Boundary-value problems, Temperature, Two-phase flow, Flow (Dynamics), Fluids, Heat flux, Heat transfer
Proceedings Papers

Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures

Quang Nguyen, M. Kaysar Rahim, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A041, July 6–9, 2015
Paper No: IPACK2015-48627
DOI: https://doi.org/10.1115/IPACK2015-48627
View Paper titled, Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures
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Topics: Stress, Shear stress, Molding, Storage, Weight (Mass), Computer simulation, Electronic packages, Engineering simulation, Failure, Finite element analysis
Proceedings Papers

Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle

Toru Ikeda, Akiko Ozaki, Takuya Hatao, Noriyuki Miyazaki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A004, July 6–9, 2015
Paper No: IPACK2015-48168
DOI: https://doi.org/10.1115/IPACK2015-48168
View Paper titled, Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle
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Topics: Cycles, Electronic packages, Warping, Heating, Package on package, Reliability, Resins, Elastic moduli, Hardening (Curing), Relaxation (Physics)
Proceedings Papers

Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT

Hyoungsoon Lee, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A018, July 6–9, 2015
Paper No: IPACK2015-48670
DOI: https://doi.org/10.1115/IPACK2015-48670
View Paper titled, Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT
Click here to open pdf in another window PDF for Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT
Topics: Computer simulation, Gallium nitride, Heat flux, Microcoolers, Microchannels, Simulation, Computational fluid dynamics, Flow (Dynamics), Fluids, Heat conduction
Proceedings Papers

A Parametric Study of the Impact of Energy Relaxation Time on Thermal Behavior of Power Si MOSFET in Electro-Thermal Analysis

Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A061, July 6–9, 2015
Paper No: IPACK2015-48802
DOI: https://doi.org/10.1115/IPACK2015-48802
View Paper titled, A Parametric Study of the Impact of Energy Relaxation Time on Thermal Behavior of Power Si MOSFET in Electro-Thermal Analysis
Click here to open pdf in another window PDF for A Parametric Study of the Impact of Energy Relaxation Time on Thermal Behavior of Power Si MOSFET in Electro-Thermal Analysis
Topics: MOSFET transistors, Relaxation (Physics), Temperature distribution, Simulation, Electric fields, Thermal properties, Heat, Physics, Temperature
Proceedings Papers

Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM

Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A003, July 16–18, 2013
Paper No: IPACK2013-73126
DOI: https://doi.org/10.1115/IPACK2013-73126
View Paper titled, Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM
Click here to open pdf in another window PDF for Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM
Topics: Finite element methods, Reliability, Temperature, Finite element analysis, Resins, Electronic packages, Hardening (Curing), Heat, Integrated circuits, Materials properties
Proceedings Papers

Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density

Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A013, July 16–18, 2013
Paper No: IPACK2013-73248
DOI: https://doi.org/10.1115/IPACK2013-73248
View Paper titled, Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density
Click here to open pdf in another window PDF for Device Simulation for Effects of Mechanical Stress on Electrical Performances of nMOSFETs: The Impacts of Stress-Induced Change of Intrinsic Carrier Density
Topics: Density, Simulation, Stress, Diffusion (Physics), Computer simulation, Electron mobility, Electrons, Heat conduction, Momentum, MOSFET transistors
Proceedings Papers

Spectral Detail of Phonon Conduction and Scattering in Graphene

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 329-343, July 6–8, 2011
Paper No: IPACK2011-52243
DOI: https://doi.org/10.1115/IPACK2011-52243
View Paper titled, Spectral Detail of Phonon Conduction and Scattering in Graphene
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Topics: Electromagnetic scattering, Graphene, Heat conduction, Phonons, Radiation scattering, Scattering (Physics), Thermal conductivity, Probability, Algorithms, Approximation
Proceedings Papers

A Study on Reliability of High-Temperature Joint in Packaging Structure

Takayuki Ishikawa, Toshikazu Oshidari, Hiromi Sugihara, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 45-51, July 6–8, 2011
Paper No: IPACK2011-52154
DOI: https://doi.org/10.1115/IPACK2011-52154
View Paper titled, A Study on Reliability of High-Temperature Joint in Packaging Structure
Click here to open pdf in another window PDF for A Study on Reliability of High-Temperature Joint in Packaging Structure
Topics: High temperature, Packaging, Reliability, Nickel plating, Aluminum, Plating, Stress, Temperature, Cooling systems, Cycles
Proceedings Papers

Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors

Masaaki Koganemaru, Keisuke Yoshida, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 479-486, July 6–8, 2011
Paper No: IPACK2011-52150
DOI: https://doi.org/10.1115/IPACK2011-52150
View Paper titled, Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors
Click here to open pdf in another window PDF for Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors
Topics: Metal oxide semiconductors, Stress, Transistors, Simulation, Electron mobility, Computer simulation, Diffusion (Physics), Electrons, Flow (Dynamics), Gates (Closures)
Proceedings Papers

Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times

Chunjian Ni, Jayathi Y. Murthy
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 99-109, July 19–23, 2009
Paper No: InterPACK2009-89181
DOI: https://doi.org/10.1115/InterPACK2009-89181
View Paper titled, Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times
Click here to open pdf in another window PDF for Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times
Topics: Anisotropy, Modeling, Phonons, Relaxation (Physics), Electromagnetic scattering, Radiation scattering, Scattering (Physics), Silicon, Accounting, Equilibrium (Physics)
Proceedings Papers

Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation

Tz-Cheng Chiu, Je-Li Kung, Yi-Shao Lai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 9-17, July 19–23, 2009
Paper No: InterPACK2009-89040
DOI: https://doi.org/10.1115/InterPACK2009-89040
View Paper titled, Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation
Click here to open pdf in another window PDF for Characterization of Cure-Dependent Viscoelastic Behavior for Molding Compound and Application to Package Warpage Simulation
Topics: Molding, Simulation, Viscoelasticity, Warping, Ball-Grid-Array packaging, Finite element analysis, Temperature, Constitutive equations, Cooling, Epoxy adhesives
Proceedings Papers

Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer

Masanori Yamagiwa, Masato Fujita, Qiang Yu, Hiromi Sugihara
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 849-855, July 19–23, 2009
Paper No: InterPACK2009-89284
DOI: https://doi.org/10.1115/InterPACK2009-89284
View Paper titled, Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer
Click here to open pdf in another window PDF for Reliability Study of High-Temperature-Resistant Mounting Structure Considering Shear Behavior of Joint Layer
Topics: Reliability, Shear (Mechanics), Temperature, Finite element analysis, Cycles, Displacement, Fatigue, Gallium nitride, Stress, Circuits
Proceedings Papers

Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Issue in Si Devices

Tomoyuki Hatakeyama, Kazuyoshi Fushinobu, Ken Okazaki, Masaru Ishizuka
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 135-141, July 19–23, 2009
Paper No: InterPACK2009-89156
DOI: https://doi.org/10.1115/InterPACK2009-89156
View Paper titled, Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Issue in Si Devices
Click here to open pdf in another window PDF for Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Issue in Si Devices
Topics: Simulation, Relaxation (Physics), Heat, Electromagnetic scattering, Energy conservation, Momentum, Radiation scattering, Scattering (Physics), Semiconductor devices, Approximation