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Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022

Paper No: IPACK2022-97452

DOI: https://doi.org/10.1115/IPACK2022-97452

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Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics

Proceedings Papers

Power Envelope Analysis for the Thermal Optimization of a Chiplet Module

Eric Ouyang, Xiao Gu, Yonghyuk Jeong, Michael Liu

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 25–27, 2022

Paper No: IPACK2022-97204

DOI: https://doi.org/10.1115/IPACK2022-97204

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Topics: Design, Heat sinks, Junctions, Optimization, Reliability, Resistors, Risk, Simulation, Temperature

Proceedings Papers

RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study

Fenny Liu, Sean Huang, Sheng Fong Yu, Chun Yen Li, Liang-Yih Hung, Yu Po Wang

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A004, October 25–27, 2022

Paper No: IPACK2022-97175

DOI: https://doi.org/10.1115/IPACK2022-97175

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Topics: Hazardous substances, Manufacturing, Phthalate plasticizers, Electronic equipment, Plasticizers, Risk, Semiconductor industry, Temperature, Weight (Mass)

Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020

Paper No: IPACK2020-2581

DOI: https://doi.org/10.1115/IPACK2020-2581

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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles

Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019

Paper No: IPACK2019-6347

DOI: https://doi.org/10.1115/IPACK2019-6347

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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits

Proceedings Papers

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, Imam Al Razi, David R. Huitink, Yarui Peng

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 7–9, 2019

Paper No: IPACK2019-6429

DOI: https://doi.org/10.1115/IPACK2019-6429

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Topics: Electronics, Hybrid electric vehicles, Reliability, Thermal management, Phase change materials, Cooling, Temperature, Electronic packaging, Heat, Automobiles

Proceedings Papers

Double Side System in Package Development Challenge for Heterogeneous Integration

Feng Kao, Yu-Po Wang, Davidlion Wang, Jensen Tsai, Mike Tsai, Ryan Chiu, Eric He

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 7–9, 2019

Paper No: IPACK2019-6354

DOI: https://doi.org/10.1115/IPACK2019-6354

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Topics: System-in-package, Molding, Simulation, Accelerated life testing, Copper, Design, Energy dissipation, Internet of things, Manufacturing, Packaging

Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017

Paper No: IPACK2017-74278

DOI: https://doi.org/10.1115/IPACK2017-74278

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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation

Proceedings Papers

Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components

Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, August 29–September 1, 2017

Paper No: IPACK2017-74190

DOI: https://doi.org/10.1115/IPACK2017-74190

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Topics: Electronic components, Failure, Vibration, Engineering standards, Reliability, Damage, Electronics, Failure mechanisms, Risk, Roads

Proceedings Papers

Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics

Pradeep Lall, Hao Zhang, Rahul Lall

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 29–September 1, 2017

Paper No: IPACK2017-74232

DOI: https://doi.org/10.1115/IPACK2017-74232

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Topics: Biometry, Design, Flexible electronics, Sensors, Electronics, Manufacturing, Reliability, Thermal stresses, Biomedicine, Copper

Proceedings Papers

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

Naoya Saiki, Yuichiro Komasu, Kazuto Aizawa, Jun Maeda

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 29–September 1, 2017

Paper No: IPACK2017-74010

DOI: https://doi.org/10.1115/IPACK2017-74010

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Topics: Adhesives, Pressure, Semiconductor wafers, Ultraviolet radiation, String, Finite element analysis, Deformation, Elongation, Finite element model, Fracture (Materials)

Proceedings Papers

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

David Huitink

Paper No: IPACK2017-74245

DOI: https://doi.org/10.1115/IPACK2017-74245

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Topics: Design, Electric vehicles, Reliability, Thermomechanics, Stress, Vehicles, Electronics, Failure, Physics, Batteries

Proceedings Papers

Large Flip Chip Assembly Challenges and Risk Mitigation Process

Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo, Eric Ouyang

Paper No: IPACK2017-74026

DOI: https://doi.org/10.1115/IPACK2017-74026

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Topics: Ball-Grid-Array packaging, Copper, Cracking (Materials), Delamination, Failure, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flip-chip packages, Fracture (Process)

Proceedings Papers

Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep

Paper No: IPACK2017-74322

DOI: https://doi.org/10.1115/IPACK2017-74322

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Topics: Bending (Stress), Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, Temperature, Fracture (Materials), Elongation, Shock (Mechanics), Failure

Proceedings Papers

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman

Paper No: IPACK2017-74073

DOI: https://doi.org/10.1115/IPACK2017-74073

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Topics: Delamination, Electronic packaging, Fracture (Materials), Simulation, Electronic packages, Copper, Finite element analysis, Fracture mechanics, Risk, Stress

Proceedings Papers

An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball

Sai Sudharsanan Paranjothy, Ganesh Subbarayan, Dae Young Jung, Bahgat G. Sammakia

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A009, July 6–9, 2015

Paper No: IPACK2015-48653

DOI: https://doi.org/10.1115/IPACK2015-48653

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Topics: Constitutive equations, Copper, Displacement, Finite element analysis, Fracture (Materials), Fracture (Process), Bonding, Electrical properties, High temperature, Modeling

Proceedings Papers

Analysis of Interfacial Shear Stress and Risk of Debonding in TSVs

Anirudh Udupa, Ganesh Subbarayan, Cheng-Kok Koh

Paper No: IPACK2015-48656

DOI: https://doi.org/10.1115/IPACK2015-48656

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Topics: Risk, Shear stress, Stress, Reliability, Copper, Delamination, Silicon, Stress singularity

Proceedings Papers

Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels

H. Y. Zhang, Xiao Yan, W. H. Zhu, Leon Lin

Paper No: IPACK2015-48088

DOI: https://doi.org/10.1115/IPACK2015-48088

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Topics: Design, Heat sinks, Silicon, Aluminum, Copper, Energy dissipation, Heat, Modeling, Slug flows, Cooling

Proceedings Papers

Consideration for Running Data Center at High Temperatures and Using Free Air Cooling

Yongzhan He, Guofeng Chen, Jiajun Zhang, Tianyu Zhou, Tao Liu, Pinyan Zhu, Chao Liu, Nishi Ahuja

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A014, July 6–9, 2015

Paper No: IPACK2015-48169

DOI: https://doi.org/10.1115/IPACK2015-48169

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Topics: Cooling, Data centers, High temperature, Corrosion, Internet, Temperature, Design, Operating temperature, Refrigeration, Carbon dioxide

Proceedings Papers

Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability

Prabjit Singh, Levente Klein, Dereje Agonafer, Jimil M. Shah, Kanan D. Pujara

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A015, July 6–9, 2015

Paper No: IPACK2015-48176

DOI: https://doi.org/10.1115/IPACK2015-48176

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Topics: Contamination, Particulate matter, Reliability, Temperature, Data centers, Electronic equipment, Temperature effects, Cutting, High temperature, Risk

NARROW

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Power Envelope Analysis for the Thermal Optimization of a Chiplet Module

RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

Double Side System in Package Development Challenge for Heterogeneous Integration

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components

Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

Large Flip Chip Assembly Challenges and Risk Mitigation Process

Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball

Analysis of Interfacial Shear Stress and Risk of Debonding in TSVs

Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels

Consideration for Running Data Center at High Temperatures and Using Free Air Cooling

Effect of Relative Humidity, Temperature and Gaseous and Particulate Contaminations on Information Technology Equipment Reliability

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