1-11 of 11
Robustness
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

AI/ML Applications for Thermally Aware SoC Designs

Adam Norman, Mark Gallina, Olena Zhu, Joyce Weiner, Fabian Garita Gonzalez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 25–27, 2022
Paper No: IPACK2022-97186
DOI: https://doi.org/10.1115/IPACK2022-97186
View Paper
PDF
Topics: Computation, Degrees of freedom, Design, Engineering disciplines, Excitation, Feedback, Machine learning, Modeling, Optimization, Robustness
Proceedings Papers

Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Ozdemir, Tricia Schwartz
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 26–28, 2021
Paper No: IPACK2021-69270
DOI: https://doi.org/10.1115/IPACK2021-69270
View Paper
PDF
Topics: Aluminum, Copper, Electronics, Sprays, Ceramics, Manufacturing, Additive manufacturing, Bonding, Deformation, Electrical properties
Proceedings Papers

Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources

Pradeep Lall, Ved Soni, Amrit Abrol, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 7–9, 2019
Paper No: IPACK2019-6570
DOI: https://doi.org/10.1115/IPACK2019-6570
View Paper
PDF
Topics: Accelerated life testing, Batteries, Cycles, Electronics, Energy efficiency, Flexible electronics, High temperature, Lithium-ion batteries, Medical devices, Regression models
Proceedings Papers

Folding-Reliability of Flexible Electronics in Wearable Applications

Pradeep Lall, Hyesoo Jang, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, October 7–9, 2019
Paper No: IPACK2019-6584
DOI: https://doi.org/10.1115/IPACK2019-6584
View Paper
PDF
Topics: Fatigue life, Flexible electronics, Reliability, Electronics, Stress, Failure mechanisms, Experimental analysis, Failure analysis, Robustness, Skin
Proceedings Papers

Practical Concerns for Adoption of Microjet Cooling

Stephen M. Walsh, James P. Smith, Eric A. Browne, Timothy W. Hennighausen, Bernard A. Malouin
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A026, August 27–30, 2018
Paper No: IPACK2018-8468
DOI: https://doi.org/10.1115/IPACK2018-8468
View Paper
PDF
Topics: Cooling, Electronics, Erosion, Flux (Metallurgy), Heat, Numerical analysis, Operating temperature, Power density, Pressure, Robustness
Proceedings Papers

Prognostics Health Management Model for LED Package Failure Under Contaminated Environment

Pradeep Lall, Hao Zhang, Lynn Davis
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A047, July 6–9, 2015
Paper No: IPACK2015-48724
DOI: https://doi.org/10.1115/IPACK2015-48724
View Paper
PDF
Topics: Errors, Failure, Kalman filters, Maintenance, Organic compounds, Phosphors, Reliability, Robustness, Service life (Equipment), Stability
Proceedings Papers

Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors

Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A021, July 16–18, 2013
Paper No: IPACK2013-73264
DOI: https://doi.org/10.1115/IPACK2013-73264
View Paper
PDF
Topics: Cooling systems, Dynamic modeling, Heat, Critical heat flux, Flow (Dynamics), Temperature, Transients (Dynamics), Condensers (steam plant), Pumps, Simulation
Proceedings Papers

PHM of Leadfree Interconnects Using Resistance Spectroscopy Based Particle Filter Models for Shock and Vibration Environments

Pradeep Lall, Ryan Lowe, Kai Goebel
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 549-562, July 6–8, 2011
Paper No: IPACK2011-52197
DOI: https://doi.org/10.1115/IPACK2011-52197
View Paper
PDF
Topics: Filters, Particulate matter, Shock (Mechanics), Spectroscopy, Vibration, Damage, Failure, Service life (Equipment), Algorithms, Electronics
Proceedings Papers

Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces With Hierarchical Roughness

Susmita Dash, Niru Kumari, Mercy Dicuangco, Suresh V. Garimella
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 685-692, July 6–8, 2011
Paper No: IPACK2011-52046
DOI: https://doi.org/10.1115/IPACK2011-52046
View Paper
PDF
Topics: Manufacturing, Surface roughness, Drops, Microscale devices, Dynamics (Mechanics), Etching, Robustness, Wetting
Proceedings Papers

Thermal and Physical Characterization and Curing Kinetics Study of a Novel Curable Fillet Forming Ball Attach Flux for Improvement of Solder Joint Reliability on Ball Grid Array Packages

Dennis Prem Kumar Chandran, Yi He, Eng Chiang Gan
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 109-114, July 6–11, 2003
Paper No: IPACK2003-35038
DOI: https://doi.org/10.1115/IPACK2003-35038
View Paper
PDF
Topics: Ball-Grid-Array packages, Hardening (Curing), Reliability, Solder joints, Polymers, Robustness, Thermal properties
Proceedings Papers

Numerical Study and Experimental Validation of the Thermal Performance for a Parallel Channel Optical Module

Z. F. Shi, Albert C. W. Lu, Eric Tan, Ronson Tan
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 317-321, July 6–11, 2003
Paper No: IPACK2003-35141
DOI: https://doi.org/10.1115/IPACK2003-35141
View Paper
PDF
Topics: Cavities, Computational fluid dynamics, Computer simulation, Heat sinks, Junctions, Lasers, Optical interconnections, Performance evaluation, Robustness, Signals