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Proceedings Papers

Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 25–27, 2022

Paper No: IPACK2022-97432

DOI: https://doi.org/10.1115/IPACK2022-97432

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Topics: Astronauts, Event history analysis, Manufacturing, Reliability, Sensors

Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022

Paper No: IPACK2022-94052

DOI: https://doi.org/10.1115/IPACK2022-94052

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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations

Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021

Paper No: IPACK2021-74074

DOI: https://doi.org/10.1115/IPACK2021-74074

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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration

Proceedings Papers

Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition

Pradeep Lall, Hyesoo Jang, Curtis Hill, Libby Creel

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 27–29, 2020

Paper No: IPACK2020-2644

DOI: https://doi.org/10.1115/IPACK2020-2644

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Topics: Biometry, Fatigue life, Flexible electronics, Reliability, Sensors

Proceedings Papers

Enabling Packaging Architectures and Interconnect Technologies for Image Sensors

Mei-Chien Lu

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 27–29, 2020

Paper No: IPACK2020-2526

DOI: https://doi.org/10.1115/IPACK2020-2526

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Topics: Architecture, Bonding, Density, Packaging, Sensors

Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020

Paper No: IPACK2020-2581

DOI: https://doi.org/10.1115/IPACK2020-2581

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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles

Proceedings Papers

Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments

Alexis Krone, Hannah Alpert, Satish Shetty, Debbie G. Senesky, Gregory Salamo, David Huitink

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 27–29, 2020

Paper No: IPACK2020-2589

DOI: https://doi.org/10.1115/IPACK2020-2589

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Topics: Gallium, Gallium nitride, Hall effect, High temperature, Magnetic fields, Reliability, Sensors

Proceedings Papers

Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies

Shuv Dey, Yogendra Joshi, J. Michael Brown

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 7–9, 2019

Paper No: IPACK2019-6515

DOI: https://doi.org/10.1115/IPACK2019-6515

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Topics: Cities, Heat, Internet of things, Packaging, Pollution, Sensor networks, Sensors

Proceedings Papers

Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management

Gary Liang, Ashkan Sadeghifard, Anirudh Krishna, Jaeho Lee, Edwin A. Peraza Hernandez

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 7–9, 2019

Paper No: IPACK2019-6402

DOI: https://doi.org/10.1115/IPACK2019-6402

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Topics: Alloys, Modeling, Shapes, Thermal management, Springs, Temperature, Solar energy, Deformation, Irradiation (Radiation exposure), Actuators

Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019

Paper No: IPACK2019-6408

DOI: https://doi.org/10.1115/IPACK2019-6408

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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability

Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019

Paper No: IPACK2019-6569

DOI: https://doi.org/10.1115/IPACK2019-6569

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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties

Proceedings Papers

Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

Jun Chen, R. C. Jaeger, J. C. Suhling

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A019, October 7–9, 2019

Paper No: IPACK2019-6461

DOI: https://doi.org/10.1115/IPACK2019-6461

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Topics: Semiconductor wafers, Sensors, Silicon, Stress, Calibration, Errors, Approximation, Design, Electronics, High temperature

Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019

Paper No: IPACK2019-6514

DOI: https://doi.org/10.1115/IPACK2019-6514

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Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption

Proceedings Papers

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, October 7–9, 2019

Paper No: IPACK2019-6580

DOI: https://doi.org/10.1115/IPACK2019-6580

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Topics: Flexible electronics, Reliability, Electronics, Failure, Lumber, Modeling, Sensors, Statistical analysis, Testing

Proceedings Papers

Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation

Mohammad Tradat, Bahgat Sammakia, Husam Alissa, Kourosh Nemati

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 27–30, 2018

Paper No: IPACK2018-8334

DOI: https://doi.org/10.1115/IPACK2018-8334

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Topics: Cooling, Data centers, Experimental analysis, Failure, Instrumentation, Cooling systems, Temperature, Containment, Equipment performance, Pressure

Proceedings Papers

Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

Richard C. Jaeger, Jun Chen, Jeffrey C. Suhling, Leonid Fursin

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, August 27–30, 2018

Paper No: IPACK2018-8219

DOI: https://doi.org/10.1115/IPACK2018-8219

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Topics: Calibration, Design, Sensors, Silicon, Stress, Resistors, Temperature, Aerospace systems, Drilling, Geothermal power stations

Proceedings Papers

Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration

Pradeep Lall, Tony Thomas

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 27–30, 2018

Paper No: IPACK2018-8356

DOI: https://doi.org/10.1115/IPACK2018-8356

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Topics: Damage assessment, Electronics, Temperature, Vibration, Damage, Failure, Signals, Safety, High temperature, Principal component analysis

Proceedings Papers

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018

Paper No: IPACK2018-8422

DOI: https://doi.org/10.1115/IPACK2018-8422

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Topics: Containment systems, Design, Air flow, Containment, Cooling, Fans, Leakage, Sensors, Control equipment, Data centers

Proceedings Papers

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 27–30, 2018

Paper No: IPACK2018-8386

DOI: https://doi.org/10.1115/IPACK2018-8386

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Topics: Condition monitoring, Electronic systems, Sensors, Vibration, Failure, Delamination, Electronics, Manufacturing, Physics, Reflow soldering

Proceedings Papers

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 29–September 1, 2017

Paper No: IPACK2017-74058

DOI: https://doi.org/10.1115/IPACK2017-74058

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Topics: Electronic systems, Sensors, Silicon, Stress, Algorithms, Delamination, Failure, Vehicles, Accelerated life testing, Acoustics

NARROW

Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments

Additive Manufacturing of Electronic Patterns for Harsh Environments

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition

Enabling Packaging Architectures and Interconnect Technologies for Image Sensors

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments

Packaging Environmental Sensors for an Internet-of-Things Solution for Urban-Microclimate Studies

Modeling and Analysis of a Shape Memory Alloy-Based Adaptive Regulator for Thermal Management

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation

Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

Assessment of Damage Progression in Automotive Electronics Assemblies Subjected to Temperature and Vibration

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

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