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Proceedings Papers

SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 25–27, 2022

Paper No: IPACK2022-97451

DOI: https://doi.org/10.1115/IPACK2022-97451

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Topics: Batteries, Biomedical equipment, Cycles, Electronics, Errors, Flexible electronics, Industrial research, Model validation, Modeling, Service life (Equipment)

Proceedings Papers

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Pradeep Lall, Tony Thomas, Ken Blecker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A019, October 26–28, 2021

Paper No: IPACK2021-74066

DOI: https://doi.org/10.1115/IPACK2021-74066

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Topics: Solders, Temperature, Vibration, Failure, Signals, Service life (Equipment), Time series, Complex systems, Dimensions, Maintenance

Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021

Paper No: IPACK2021-74044

DOI: https://doi.org/10.1115/IPACK2021-74044

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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature

Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019

Paper No: IPACK2019-6347

DOI: https://doi.org/10.1115/IPACK2019-6347

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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits

Proceedings Papers

Thermal Performance Evaluation of Three Types of Novel End-of-Aisle Cooling Systems

Manasa Sahini, Dereje Agonafer, Vijayalan Pandiyan

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, August 29–September 1, 2017

Paper No: IPACK2017-74016

DOI: https://doi.org/10.1115/IPACK2017-74016

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Topics: Computational fluid dynamics, Containment, Cooling, Cooling systems, Data centers, Design, Exhaust systems, Fans, Flow (Dynamics), Hardware

Proceedings Papers

Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation

Pradeep Lall, Nakul Kothari, John Deep

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, August 29–September 1, 2017

Paper No: IPACK2017-74269

DOI: https://doi.org/10.1115/IPACK2017-74269

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Topics: Damage, Shock (Mechanics), X-rays, Reliability, Deformation, Failure, Imaging, Manufacturing, Nondestructive evaluation, Service life (Equipment)

Proceedings Papers

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone

Pradeep Lall, Amrit Abrol, David Locker

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A022, August 29–September 1, 2017

Paper No: IPACK2017-74252

DOI: https://doi.org/10.1115/IPACK2017-74252

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Topics: Microelectromechanical systems, Microphones, Reliability, Temperature, High temperature, Service life (Equipment), Analytical methods, Engineers, Failure analysis, Failure mechanisms

Proceedings Papers

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 29–September 1, 2017

Paper No: IPACK2017-74208

DOI: https://doi.org/10.1115/IPACK2017-74208

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Topics: Electronics, Reliability, Safety, Automotive industry, Failure, Vehicles, Actuators, Computation, Design, Electric vehicles

Proceedings Papers

Prognostics Health Management Model for LED Package Failure Under Contaminated Environment

Pradeep Lall, Hao Zhang, Lynn Davis

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A047, July 6–9, 2015

Paper No: IPACK2015-48724

DOI: https://doi.org/10.1115/IPACK2015-48724

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Topics: Errors, Failure, Kalman filters, Maintenance, Organic compounds, Phosphors, Reliability, Robustness, Service life (Equipment), Stability

Proceedings Papers

Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators

Pradeep Lall, Kazi Mirza, Mahendra Harsha, Jeff Suhling, Kai Goebel

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A025, July 16–18, 2013

Paper No: IPACK2013-73309

DOI: https://doi.org/10.1115/IPACK2013-73309

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Topics: Electronics, Reliability, Storage, Damage, Temperature, Avionics, Electronic systems, Failure, High temperature, Intermetallic compounds

Proceedings Papers

Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging

Pradeep Lall, Peter Sakalaukus, Lynn Davis

Paper No: IPACK2013-73250

DOI: https://doi.org/10.1115/IPACK2013-73250

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Topics: Algorithms, Aluminum, Capacitance, Capacitors, Climate, Damage, Electrical components, Failure, High temperature, Service life (Equipment)

Proceedings Papers

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability

Pradeep Lall, Ryan Lowe, Kai Goebel

Paper No: IPACK2013-73252

DOI: https://doi.org/10.1115/IPACK2013-73252

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Topics: Algorithms, Reliability, Kalman filters, Ball-Grid-Array packaging, Failure, Filters, Particulate matter, Printed circuit boards, Service life (Equipment), Solder joints

Proceedings Papers

Leading Indicators for Prognostication of Impending Failures on Cu-Al Interconnects

Pradeep Lall, Shantanu Deshpande

Paper No: IPACK2013-73287

DOI: https://doi.org/10.1115/IPACK2013-73287

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Topics: Failure, Intermetallic compounds, Wire, Damage, Service life (Equipment), Wire bonding, Algorithms, Aluminum, Copper, Electronic packaging

Proceedings Papers

Characterization of a Macrofiber Piezoelectric Composite

David A. Miller

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 437-441, July 6–8, 2011

Paper No: IPACK2011-52293

DOI: https://doi.org/10.1115/IPACK2011-52293

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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Displacement measurement, Electrical measurement, Excitation, Fibers, Laminates, Resonance, Service life (Equipment)

Proceedings Papers

PHM of Leadfree Interconnects Using Resistance Spectroscopy Based Particle Filter Models for Shock and Vibration Environments

Pradeep Lall, Ryan Lowe, Kai Goebel

Paper No: IPACK2011-52197

DOI: https://doi.org/10.1115/IPACK2011-52197

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Topics: Filters, Particulate matter, Shock (Mechanics), Spectroscopy, Vibration, Damage, Failure, Service life (Equipment), Algorithms, Electronics

Proceedings Papers

Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments

Pradeep Lall, Rahul Vaidya, Vikrant More, Jeff Suhling, Kai Goebel

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 873-885, July 19–23, 2009

Paper No: InterPACK2009-89299

DOI: https://doi.org/10.1115/InterPACK2009-89299

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Topics: Damage, Electronics, Service life (Equipment), Thermomechanics, Algorithms, Alloys, Circuits, Condition monitoring, Delamination, Fracture (Materials)

Proceedings Papers

Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities

Arun Gowda, Annita Zhong, Sandeep Tonapi, Kaustubh Nagarkar, K. Srihari

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1911-1918, July 17–22, 2005

Paper No: IPACK2005-73490

DOI: https://doi.org/10.1115/IPACK2005-73490

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Topics: Mechanical properties, Silicones, Heat, Adhesives, Fillers (Materials), Flat heat pipes, Microelectronic devices, Phase change materials, Pumps, Resins

Proceedings Papers

Humidity Control Simulation for Electronics Packaging

David G. Myers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 767-777, July 6–11, 2003

Paper No: IPACK2003-35057

DOI: https://doi.org/10.1115/IPACK2003-35057

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Topics: Electronic packaging, Leakage, Simulation, Design, Cycles, Diffusion (Physics), Sealing (Process), Service life (Equipment), Simulation results, Temperature

NARROW

SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Thermal Performance Evaluation of Three Types of Novel End-of-Aisle Cooling Systems

Damage Progression in Fuze Assemblies Subjected to High-G Mechanical Shock Using X-Ray Digital Volume Correlation

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Prognostics Health Management Model for LED Package Failure Under Contaminated Environment

Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators

Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability

Leading Indicators for Prognostication of Impending Failures on Cu-Al Interconnects

Characterization of a Macrofiber Piezoelectric Composite

PHM of Leadfree Interconnects Using Resistance Spectroscopy Based Particle Filter Models for Shock and Vibration Environments

Remaining Useful-Life Based on Damage Pre-Cursors for Leadfree Electronics Subjected to Multiple Thermal-Environments

Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities

Humidity Control Simulation for Electronics Packaging

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