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Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Paper No: IPACK2022-97457
DOI: https://doi.org/10.1115/IPACK2022-97457
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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

Karthik Arun Deo, Raymond-Noel Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A005, October 25–27, 2022
Paper No: IPACK2022-97253
DOI: https://doi.org/10.1115/IPACK2022-97253
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Topics: Ball-Grid-Array packaging, Fatigue life, Solder joints, Surface mount devices
Proceedings Papers

PHM Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 27–29, 2020
Paper No: IPACK2020-2614
DOI: https://doi.org/10.1115/IPACK2020-2614
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Topics: Printed circuit boards, Thermomechanics, Stress, Ceramics, Control panels, Deformation, Electronic components, Experimental methods, Finite element analysis, Reliability
Proceedings Papers

Reliability of Interconnections Made of Sintered Silver Nano Particles

Przemyslaw K. Matkowski, Tomasz Falat, Andrzej Moscicki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A016, July 6–9, 2015
Paper No: IPACK2015-48795
DOI: https://doi.org/10.1115/IPACK2015-48795
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Topics: Nanoparticles, Reliability, Silver, Sensors, Algorithms, Chain, Coating processes, Coatings, Computerized tomography, Failure mechanisms
Proceedings Papers

Larger Array Fine Pitch Wafer Level Package Drop Test Reliability

Tiao Zhou, Robert Derk, Kaysar Rahim, Xuejun Fan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 693-701, July 19–23, 2009
Paper No: InterPACK2009-89018
DOI: https://doi.org/10.1115/InterPACK2009-89018
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Topics: Reliability, Semiconductor wafers, Fracture (Materials), Corners (Structural elements), Failure, Alloys, Failure mechanisms, Finite element analysis, Solder joints, Solders
Proceedings Papers

A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures

Hisashi Tanie, Takeshi Terasaki, Yasuhiro Naka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1229-1235, July 17–22, 2005
Paper No: IPACK2005-73331
DOI: https://doi.org/10.1115/IPACK2005-73331
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Topics: Fatigue life, Semiconductors (Materials), Solders, Crack propagation, Fracture (Materials), Ball-Grid-Array packaging, Solder joints, Surface mount devices, Diluents, Damage
Proceedings Papers

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005
Paper No: IPACK2005-73239
DOI: https://doi.org/10.1115/IPACK2005-73239
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Topics: Alloys, Creep, Heat, Manufacturing, Modeling, Surface mount devices, Bulk solids, Solders, Solder joints, Thermomechanics
Proceedings Papers

BGA Reliability in Automotive Underhood Applications

Pradeep Lall, Nokibul Islam, Jeffrey Suhling, Robert Darveaux
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 823-830, July 6–11, 2003
Paper No: IPACK2003-35243
DOI: https://doi.org/10.1115/IPACK2003-35243
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Topics: Ball-Grid-Array packaging, Reliability, Crack propagation, Damage, High temperature, Surface mount devices, Temperature, Errors, Fatigue, Glass transition