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Proceedings Papers

Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level

Himanshu Modi, Pardeep Shahi, Akiilessh Sivakumar, Satyam Saini, Pratik Bansode, Vibin Shalom, Amrutha Valli Rachakonda, Gautam Gupta, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 25–27, 2022
Paper No: IPACK2022-97443
DOI: https://doi.org/10.1115/IPACK2022-97443
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Topics: Computational fluid dynamics, Cooling, Transient analysis, Transients (Dynamics)
Proceedings Papers

Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants

Shuai Shao, Tianyi Gao, Huawei Yang, Jie Zhao, Jiajun Zhang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 27–29, 2020
Paper No: IPACK2020-2670
DOI: https://doi.org/10.1115/IPACK2020-2670
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Topics: Coolants, Cooling, Cooling systems, Fluids, Graphics processing units, Power density, Data centers, Temperature, Decision making, Density
Proceedings Papers

System Electrothermal Transient Analysis of a High Current (40A) Synchronous Step Down Converter

Rajen Murugan, Jie Chen, Todd Harrison, C. T. Kao, Nathan Ai
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A004, October 7–9, 2019
Paper No: IPACK2019-6384
DOI: https://doi.org/10.1115/IPACK2019-6384
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Topics: Capacitors, Design, Inductors, Modeling, Multi-chip modules, Packaging, Power density, Silicon, Simulation, Transient analysis
Proceedings Papers

Real-Time Data Center Transient Analysis

Xuanhang Simon Zhang, James W. VanGilder
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 471-477, July 6–8, 2011
Paper No: IPACK2011-52088
DOI: https://doi.org/10.1115/IPACK2011-52088
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Topics: Data centers, Transient analysis, Cooling, Transients (Dynamics), Design, Computer software, Failure, Fans, Pumps, Stress
Proceedings Papers

A New Resistor-Capacitor (RC) Transient Thermal Network Approach for Power Amplifier Module in Handheld Telecommunication

Youmin Yu, Victor Adrian Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 783-790, July 8–12, 2007
Paper No: IPACK2007-33335
DOI: https://doi.org/10.1115/IPACK2007-33335
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Topics: Capacitors, Resistors, Telecommunications, Transients (Dynamics), Temperature, Cycles, Heat, Topology, Curve fitting, Simulation
Proceedings Papers

Mechanical Shock FE Modeling for ATCA Circuit Board Design

Frank Z. Liang, Larry M. Palanuk, Wade Hezeltine
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1487-1492, July 17–22, 2005
Paper No: IPACK2005-73274
DOI: https://doi.org/10.1115/IPACK2005-73274
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Topics: Design, Modeling, Printed circuit boards, Shock (Mechanics), Finite element model, Bricks, Design engineering, Displacement, Displacement measurement, Dynamic response
Proceedings Papers

Prediction of Equilibrium and Stability of Molten Solder Geometries by Finite Element Analysis

Takahiro Nagata, Takaya Kobayashi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1181-1186, July 17–22, 2005
Paper No: IPACK2005-73162
DOI: https://doi.org/10.1115/IPACK2005-73162
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Topics: Equilibrium (Physics), Finite element analysis, Solders, Stability, Drops, Surface tension, Constitutive equations, Deformation, Fluids, Creep