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Proceedings Papers

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022

Paper No: IPACK2022-96635

DOI: https://doi.org/10.1115/IPACK2022-96635

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Topics: Additive manufacturing, Electronics, Impingement cooling, Jets, Heat transfer, Nozzles, Turbulence, Aluminum, Cooling, Fluids

Proceedings Papers

Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

Daeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 25–27, 2022

Paper No: IPACK2022-97218

DOI: https://doi.org/10.1115/IPACK2022-97218

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Topics: Bonding, Computation, Computer simulation, Deformation, Design, Engineering prototypes, Flow (Dynamics), Levitation, Optimization, Physics

Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019

Paper No: IPACK2019-6585

DOI: https://doi.org/10.1115/IPACK2019-6585

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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software

Proceedings Papers

Experimental Study on Flow Evaporation Heat Transfer Characteristics Inside Horizontal Three-Dimensional Enhanced Tubes

Wei Li, Chuancai Zhang, Zhichuan Sun, Zhichun Liu, Lianxiang Ma, Yan He, Bin Zhang, Wei Chen, David J. Kukulka

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A024, August 27–30, 2018

Paper No: IPACK2018-8454

DOI: https://doi.org/10.1115/IPACK2018-8454

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Topics: Evaporation, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Temperature, Turbulence, Vapors

Proceedings Papers

Unsteady Heat Flux Measurements in Agitated Channel Flows

Smita Agrawal, Terrence Simon, Mark North, Tianhong Cui

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A009, July 6–9, 2015

Paper No: IPACK2015-48753

DOI: https://doi.org/10.1115/IPACK2015-48753

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Topics: Channel flow, Heat flux, Flow (Dynamics), Cycles, Heat sinks, Convection, Fluctuations (Physics), Heat exchangers, Heat transfer, Turbulence

Proceedings Papers

Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators

Kazuma Obata, Takashi Fukue, Koichi Hirose, Mamoru Kikuchi, Yasuhiko Ueda, Shigekado Kusabuka, Tomoyasu Miyahara

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A045, July 6–9, 2015

Paper No: IPACK2015-48607

DOI: https://doi.org/10.1115/IPACK2015-48607

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Topics: Cooling, Flow (Dynamics), Generators, Heat sinks, Vortices, Water, Heat, Density, Electric vehicles, Energy dissipation

Proceedings Papers

Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center

Sami A. Alkharabsheh, Saurabh K. Shrivastava, Bahgat G. Sammakia

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A019, July 16–18, 2013

Paper No: IPACK2013-73216

DOI: https://doi.org/10.1115/IPACK2013-73216

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Topics: Containment, Data centers, Flow (Dynamics), Leakage, Temperature, Containment systems, Air flow, Approximation, Buoyancy, Computational fluid dynamics

Proceedings Papers

A Numerical Steady State and Dynamic Study in a Data Center Using Calibrated Fan Curves for CRACs and Servers

Sami A. Alkharabsheh, Bahgat Sammakia, Saurabh Shrivastava, Michael Ellsworth, Milnes David, Roger Schmidt

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A020, July 16–18, 2013

Paper No: IPACK2013-73217

DOI: https://doi.org/10.1115/IPACK2013-73217

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Topics: Data centers, Steady state, Flow (Dynamics), Temperature, Buoyancy, Dynamic models, Energy dissipation, Failure, Air flow, Approximation

Proceedings Papers

Experimental Investigation of the Effect of Synthetic Jets in Minichannels With Subcooled Boiling Flow

David M. Sykes, Andrew L. Carpenter, Gregory S. Cole

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A044, July 16–18, 2013

Paper No: IPACK2013-73204

DOI: https://doi.org/10.1115/IPACK2013-73204

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Topics: Boiling, Flow (Dynamics), Jets, Subcooling, Heat transfer coefficients, Heat transfer, Microchannels, Momentum, Wall temperature, Boundary layers

Proceedings Papers

Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink

Afzal Husain, Jun-Hee Kim, Kwang-Yong Kim

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A013, July 16–18, 2013

Paper No: IPACK2013-73063

DOI: https://doi.org/10.1115/IPACK2013-73063

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Topics: Heat sinks, Silicon, Flow (Dynamics), Laminar flow, Design, Boundary-value problems, Cross-flow, Electronics, Heat flux, Heat transfer

Proceedings Papers

Potential-Flow Modeling for Data Center Applications

Christopher M. Healey, James W. VanGilder, Zachary R. Sheffer, Xuanhang Simon Zhang

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 527-534, July 6–8, 2011

Paper No: IPACK2011-52136

DOI: https://doi.org/10.1115/IPACK2011-52136

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Topics: Data centers, Flow (Dynamics), Modeling, Computational fluid dynamics, Friction, Air flow, Buoyancy, Design, Fluid dynamics, Heat transfer

Proceedings Papers

Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi, Madhusudan Iyengar, Roger Schmidt

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 953-961, July 19–23, 2009

Paper No: InterPACK2009-89306

DOI: https://doi.org/10.1115/InterPACK2009-89306

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Topics: Computer simulation, Data centers, Computational fluid dynamics, Turbulence, Flow (Dynamics), Temperature, Compacting, Cooling, Design, Heat transfer

Proceedings Papers

Fluid Flow Behavior for a Confined Rotating MCM Disk With Round Jet Array Impingement

C. J. Fang, C. Y. Lee, C. H. Peng, T. W. Lin, Y. H. Hung

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 917-924, July 8–12, 2007

Paper No: IPACK2007-33278

DOI: https://doi.org/10.1115/IPACK2007-33278

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Topics: Disks, Fluid dynamics, Nozzles, Reynolds number, Separation (Technology), Turbulence

Proceedings Papers

Comparison Between Numerical and Experimental Temperature Distributions in a Small Data Center Test Cell

Madhusudan Iyengar, Roger R. Schmidt, Hendrik Hamann, Jim VanGilder

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 819-826, July 8–12, 2007

Paper No: IPACK2007-33508

DOI: https://doi.org/10.1115/IPACK2007-33508

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Topics: Data centers, Temperature distribution, Errors, Server racks, Temperature, Air conditioning, Computer simulation, Exhaust systems, Flow (Dynamics), Modeling

Proceedings Papers

Experimental Thermal Characterization of Pin Fin Heat Sinks With Top and Side Bypass

Ning Lei, Alfonso Ortega

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 291-298, July 17–22, 2005

Paper No: IPACK2005-73222

DOI: https://doi.org/10.1115/IPACK2005-73222

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Topics: Heat sinks, Thermal characterization, Clearances (Engineering), Flow (Dynamics), Thermal resistance, Heat transfer coefficients, Aluminum, Heat flux, Pins (Engineering), Temperature

Proceedings Papers

Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow

Felipe E. Ortega Gutierrez, Alfonso Ortega, Guoping Xu

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 315-327, July 17–22, 2005

Paper No: IPACK2005-73228

DOI: https://doi.org/10.1115/IPACK2005-73228

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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Heat, Temperature measurement, Boundary-value problems, Clearances (Engineering), Copper, Cross-flow, Finishes

Proceedings Papers

Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When Adjacent Racks Are Removed

Roger Schmidt, Ethan Cruz

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 481-493, July 6–11, 2003

Paper No: IPACK2003-35240

DOI: https://doi.org/10.1115/IPACK2003-35240

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Topics: Computers, Data centers, Temperature, Computational fluid dynamics, Flow (Dynamics), Tiles, Computer simulation, Design, Electronic equipment, Temperature distribution

Proceedings Papers

Raised Floor Computer Data Center: Effect of Rack Inlet Temperatures When Rack Flowrates Are Reduced

Roger Schmidt, Ethan Cruz

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 495-508, July 6–11, 2003

Paper No: IPACK2003-35241

DOI: https://doi.org/10.1115/IPACK2003-35241

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Topics: Computers, Data centers, Temperature, Computational fluid dynamics, Flow (Dynamics), Tiles, Computer simulation, Design, Electronic equipment, Exhaust systems

Proceedings Papers

Low-Profile Synthetic Jet Cooling for Portable Computers

Raghav Mahalingam, Ari Glezer

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 147-151, July 6–11, 2003

Paper No: IPACK2003-35069

DOI: https://doi.org/10.1115/IPACK2003-35069

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Topics: Computers, Cooling, Cavities, Ejectors, Fluids, Channel flow, Diaphragms (Mechanical devices), Diaphragms (Structural), Ducts, Electronic systems

Proceedings Papers

Effect of Manifold Design on Flow Distribution in Parallel Micro-Channels

Ralph L. Webb

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 527-535, July 6–11, 2003

Paper No: IPACK2003-35251

DOI: https://doi.org/10.1115/IPACK2003-35251

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Topics: Design, Flow (Dynamics), Manifolds, Microchannels, Friction, Manufacturing, Microelectromechanical systems, Cooling, Reynolds number, Shapes

NARROW

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Experimental Study on Flow Evaporation Heat Transfer Characteristics Inside Horizontal Three-Dimensional Enhanced Tubes

Unsteady Heat Flux Measurements in Agitated Channel Flows

Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators

Effect of Cold Aisle Containment Leakage on Flow Rates and Temperatures in a Data Center

A Numerical Steady State and Dynamic Study in a Data Center Using Calibrated Fan Curves for CRACs and Servers

Experimental Investigation of the Effect of Synthetic Jets in Minichannels With Subcooled Boiling Flow

Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink

Potential-Flow Modeling for Data Center Applications

Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell

Fluid Flow Behavior for a Confined Rotating MCM Disk With Round Jet Array Impingement

Comparison Between Numerical and Experimental Temperature Distributions in a Small Data Center Test Cell

Experimental Thermal Characterization of Pin Fin Heat Sinks With Top and Side Bypass

Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow

Raised Floor Computer Data Center: Effect on Rack Inlet Temperatures When Adjacent Racks Are Removed

Raised Floor Computer Data Center: Effect of Rack Inlet Temperatures When Rack Flowrates Are Reduced

Low-Profile Synthetic Jet Cooling for Portable Computers

Effect of Manifold Design on Flow Distribution in Parallel Micro-Channels

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