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Keywords: antenna in package (AiP)
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Proceedings Papers
Po Yuan (James) Su, Yu Po Wang, Yu Cheng Pai, Ying Wei Lu, Teny Shih, Andrew Kang, David Lai, Don Son Jiang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 27–29, 2020
Paper No: IPACK2020-2507
... is shunk from PCB level to package level, therefore Antenna in Package (AiP) is developed. Recently, high bandwidth with high performance data rate transmission is the key for 5G and that also can provide the lower latency than current fourth generation. That is the reason can be explained that millimeter...
