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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97587
... datacenter air-cooling hybrid cooling energy savings ducting chassis optimization Abstract In recent years, there has been a significant increase in cloud computing, networking, virtualization, and storage applications, leading to an increase in demand for high-performance servers...