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Keywords: copper
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
... direct-write technique additive printing flexible electronics polyimide substrate copper neural network regression IMC Abstract For many years, traditional rigid PCBs have been utilized in many applications and have been shown to be reliable in a number of applications...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73334
... copper wetting superhydrophilicy contact angle porous structure copper oxide capillary wicking Abstract Two-phase, capillary-fed cooling devices are appealing thermal management technologies due to their potential for high heat transfer performance and ease of system-level...
Topics: Copper