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Keywords: copper
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Paper No: IPACK2022-97457
... done on copper sintering using various methodologies, but there is no prediction model to apply the underlying information directly for predicting the performance of the printed electronics. The sintering process determines the electrical performance of printed traces, and it is necessary to comprehend...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 26–28, 2021
Paper No: IPACK2021-73334
... Abstract Two-phase, capillary-fed cooling devices are appealing thermal management technologies due to their potential for high heat transfer performance and ease of system-level integration. While existing evaporative wicking structures such as copper inverse opals (CIOs) and copper wire...
Topics: Copper