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Keywords: flexible electronics
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112061
... Abstract Sustainable conductive ink for 3D-printed flexible electronics is needed to enable lower-impact waste print processes. The ability to undertake reparability is an additional method to achieve sustainable products through the extension of electronic components’ lifespan and reduced e...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112069
... have employed the OrCAD software to build and simulate a digital circuit. The performance of the inverting circuit was compared and evaluated against the tolerance limits of the COTs. direct-write technique additive printing in-mold electronics flexible electronics PC silver ink...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
... attachment in FHE. Such insights can aid in the development of reliable and efficient interconnectivity methods for FHE, which can contribute to the widespread adoption of FHE in various industries. additive manufacturing flexible electronics bonding materials direct write Proceedings of the ASME...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97451
... accelerated life cycling tests of batteries with random variation in these two parameters, individually and simultaneously. Finally, multiple iterations of the SOH estimation models have been presented with different predictor variables to minimize the model validation error. flexible electronics...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
... Abstract For many years, traditional rigid PCBs have been utilized in many applications and have been shown to be reliable in a number of applications. There hasn’t been much research on flexible electronics device attachment techniques and process reliability. There has been prior research...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
... the intermetallics at the interface of conductive adhesive and additively printed circuits. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge gauge factor shear load to failure Proceedings of the ASME 2022 International...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
... rigid, flexible, or conformable, provides several benefits over conventional electronics fabrication methods. Furthermore, the growing complexity of flexible electronics necessitates the development of multilayered circuits similar to traditional PCBs to decrease the volumetric and gravimetric effect...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74570
... tensile cyclic loading (3-point bending) at various strain rates and maximum strains. Long-term performance testing will be carried out using cyclic tensile loads. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74073
...-write technique additive printing flexible electronics polyimide substrate silver ink electrically conductive adhesive process development sintering analysis shear load to failure LC filter Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68902
... under high-density electric current. Reducing EM damage is extremely important to enhance device reliability. In this study, high-density current loading tests of flexible electronic line were conducted under bending deformation of the substrate in order to investigate the effect of mechanical stress...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74088
... as to study the effect of lamination parameters. flexible electronics Li-ion battery capacity degradation state of health lamination encapsulation Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74115
... as to generate high fidelity data. Ultimately, a regression model developed previously has been augmented with the results generated in the current study. flexible electronics Li-ion battery capacity degradation flex to install dynamic fold flexure fold diameter Proceedings of the ASME 2021...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2644
... Contract, NASA MSFC Tele: +1(334)844-3424; E-mail: lall@auburn.edu ABSTRACT Wearable electronics need a number of desirable attributes, such as being compact, flexible, and lightweight. Prior studies on reliability testing have examined the relationship between a flexible electronic and repetitive human...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2661
... was developed to capture the effect of these use parameters on battery capacity degradation. Keywords flexible electronics, capacity degradation, flex to install, flexure, li-ion battery, power source 1. INTRODUCTION Owing to the high specific energy and high specific power combination, lithium-ion batteries [1...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6570
... on several parameters was developed to estimate the battery capacity as a function of the cycle number. Keywords: flexible electronics, capacity degradation, shallow charging, li-ion battery, power source 1. INTRODUCTION Lithium ion batteries (Li-ion batteries or LIBs) have been the popular battery chemistry...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 947-953, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33448
... substrates. The performance of the transistors were characterized and discussed. Keywords: Nanoparticle, imprint, organic transistor, flexible electronics INTRODUCTION Direct nanoimprinting of SAM (self assembled monolayer)-protected gold nanoparticles was explored to develop a novel high resolution direct...