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1-14 of 14
Keywords: flexible electronics
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Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 25–27, 2022
Paper No: IPACK2022-97451
... accelerated life cycling tests of batteries with random variation in these two parameters, individually and simultaneously. Finally, multiple iterations of the SOH estimation models have been presented with different predictor variables to minimize the model validation error. flexible electronics...
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Paper No: IPACK2022-97457
... Abstract For many years, traditional rigid PCBs have been utilized in many applications and have been shown to be reliable in a number of applications. There hasn’t been much research on flexible electronics device attachment techniques and process reliability. There has been prior research...
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Paper No: IPACK2022-97456
... the intermetallics at the interface of conductive adhesive and additively printed circuits. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge gauge factor shear load to failure Proceedings of the ASME 2022 International...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Paper No: IPACK2021-74086
... rigid, flexible, or conformable, provides several benefits over conventional electronics fabrication methods. Furthermore, the growing complexity of flexible electronics necessitates the development of multilayered circuits similar to traditional PCBs to decrease the volumetric and gravimetric effect...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021
Paper No: IPACK2021-74570
... tensile cyclic loading (3-point bending) at various strain rates and maximum strains. Long-term performance testing will be carried out using cyclic tensile loads. direct-write technique additive printing flexible electronics polyimide substrate silver ink process development strain gauge...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021
Paper No: IPACK2021-74073
...-write technique additive printing flexible electronics polyimide substrate silver ink electrically conductive adhesive process development sintering analysis shear load to failure LC filter Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 26–28, 2021
Paper No: IPACK2021-68902
... under high-density electric current. Reducing EM damage is extremely important to enhance device reliability. In this study, high-density current loading tests of flexible electronic line were conducted under bending deformation of the substrate in order to investigate the effect of mechanical stress...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 26–28, 2021
Paper No: IPACK2021-74088
... as to study the effect of lamination parameters. flexible electronics Li-ion battery capacity degradation state of health lamination encapsulation Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 26–28, 2021
Paper No: IPACK2021-74115
... as to generate high fidelity data. Ultimately, a regression model developed previously has been augmented with the results generated in the current study. flexible electronics Li-ion battery capacity degradation flex to install dynamic fold flexure fold diameter Proceedings of the ASME 2021...
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 27–29, 2020
Paper No: IPACK2020-2644
... Abstract Wearable electronics need a number of desirable attributes, such as being compact, flexible, and lightweight. Prior studies on reliability testing have examined the relationship between a flexible electronic and repetitive human body motions (i.e., stretching, bending, twisting...
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 27–29, 2020
Paper No: IPACK2020-2661
... degradation. flexible electronics capacity degradation flex to install flexure Li-ion battery power source EFFECT OF FLEX-TO-INSTALL AND DYNAMIC FOLDING ON LI-ION BATTERY PERFORMANCE DEGRADATION SUBJECTED TO VARYING ORIENTATIONS, FOLDING SPEEDS, DEPTHS OF CHARGE AND C-RATES Pradeep Lall1, Ved...
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 7–9, 2019
Paper No: IPACK2019-6570
... efficiency. Finally, a regression model based on several parameters was developed to estimate the battery capacity as a function of the cycle number. flexible electronics capacity degradation shallow charging Li-ion battery power source EFFECT OF CHARGE-DISCHARGE DEPTH AND ENVIRONMENT USE...
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 947-953, July 8–12, 2007
Paper No: IPACK2007-33448
... substrates. The performance of the transistors were characterized and discussed. Keywords: Nanoparticle, imprint, organic transistor, flexible electronics INTRODUCTION Direct nanoimprinting of SAM (self assembled monolayer)-protected gold nanoparticles was explored to develop a novel high resolution direct...
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1935-1941, July 17–22, 2005
Paper No: IPACK2005-73186
... Direct printing of functional material has gained significant interest as an alternative to conventional integrated circuit (IC) process especially in the area of flexible electronics. Conventional lithographic processes are well developed for the patterning of inorganic microelectronics. However...