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Keywords: hybrid cooling
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112010
... but also associated electronic components like DRAMs, Platform Control Hub (PCH), and other I/O chipsets on a typical server board. Therefore, unlike air hybrid cooling which uses liquid for cold plates and air as the secondary medium of cooling the associated electronics, we foresee using immersion-based...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112078
... rear door heat exchanger hybrid cooling high density racks high performance computing air cooling Abstract Data centers have complex environments that undergo constant changes due to fluctuations in IT load, commissioning and decommissioning of IT equipment, heterogeneous rack...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111959
... and outside of the data center. Comprehensive analysis has been performed while transitioning from air cooling to hybrid cooling as efficiency of the components play an important role in determining the total power consumption. In this analysis, TCO modeling is facilitated with TUE number for cases being...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97494
... a datacenter with only RDHx and no peripheral CRAC/CRAH units while maintaining the thermal envelop. The research will also provide a guideline in implementing RDHx based on the heat load and server design. rear door heat exchanger hybrid cooling high density racks high performance computing...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97587
... datacenter air-cooling hybrid cooling energy savings ducting chassis optimization Abstract In recent years, there has been a significant increase in cloud computing, networking, virtualization, and storage applications, leading to an increase in demand for high-performance servers...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97445
... hybrid cooling liquid cooling cold plate heat capture ratio Abstract Rising power densities at the server level due to increasing performance demands are being met by using efficient thermal management methods such as direct-to-chip liquid cooling. The use of cold plates...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73101
... efficiency requirements in high density data centers. In this paper, a hybrid cooling system in data centers is investigated. In addition to traditional raised floor, cold aisle-hot aisle configuration, a liquid-air hybrid cooling system consisting of rear door heat exchangers attached to the back of racks...