1-4 of 4
Keywords: interfacial fracture toughness
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
... characteristic in evaluating the chip/UF interfacial reliability is the interfacial fracture toughness of the chip/UF interfaces. The interfacial crack could rapidly spread to the solder joints, leading to system failure. The chip/UF interface properties may change over time in response to high-temperature...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97427
.... isothermal exposure thermal aging cohesive zone modeling interfacial fracture toughness delamination epoxy/PCB interface delamination potting compounds Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97424
... isothermal exposure FCBGA thermal aging interfacial fracture toughness delamination chip/underfill Abstract Underhood applications in automotive are increasingly using electronics systems for safety and critical functions. In flip-chip ball grid array (FCBGA) packages, underfill (UF...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1669-1677, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73495
... A new test method, Single-Strip Decohesion Test (SSDT), has been developed and used to measure the interfacial fracture toughness of nano-scale thin film on substrate. This fixtureless test employs a stress-engineered superlayer deposited on patterned titanium (Ti) film strips to supply...