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Keywords: rear door heat exchanger
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112078
... data center heterogeneity and analyze the impact of two different cooling mechanisms on operational efficiency. This research focuses on comparing the cooling based on facility water for Rear Door Heat Exchanger (RDHx) and conventional Computer Room Air Conditioning (CRAH) systems in two different data...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97494
... in optimal conditions as the datacenter thermal footprint or rack density grows, resulting in thermal throttling. To sustain the growing needs, Rear Door Heat Exchangers (RDHx) are deployed in existing datacenters along with peripheral Computer Room Air Handling/Conditioning (CRAH/CRAC) units. RDHx transfers...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73101
... hybrid cooling rear door heat exchanger energy consumption Data centers consume a considerable amount of energy which is estimated to be about 2 percent of the total electrical energy consumed in the US, and their power consumption continues to increase every year. It is also estimated...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 863-873, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89213
... rear door heat exchanger data center hydro cluster Bluefire Proceedings of IPACK2009 ASME InterPACK 09 San Francisco, California, USA July 19-23, 2009 IPACK2009-89213 IBM s POWER6 High Performance Water Cooled Cluster at NCAR -Infrastructure Design- Roger Schmidt, c28rrs@us.ibm.com Gary New...
Topics: Design, Doors, Water