1-2 of 2
Keywords: regression
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Paper No: IPACK2022-97457
DOI: https://doi.org/10.1115/IPACK2022-97457
... and estimate the resistivity of printed traces. This study developed a regression model based on an Artificial Neural Network (ANN) to predict resistivity. Because flexible substrates allow for more flexibility, it is critical to create a reliable way of attaching components to circuits that can endure various...
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
Click here to open pdf in another window PDF for Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

Prediction and Control Technique of the Paper Media Temperature After Fusing in Electrophotographic Process

Shunsuke Kawasaki, Shinichi Kuramoto, Kazuyoshi Fushinobu, Koichi Kato, Kimiharu Yamazaki, Kaori Hemmi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 7–9, 2019
Paper No: IPACK2019-6396
DOI: https://doi.org/10.1115/IPACK2019-6396
... is an effective method for predicting and controlling the paper temperature after fusing. machine learning paper temperature after fusing EP printer regression PREDICTION AND CONTROL TECHNIQUE OF THE PAPER MEDIA TEMPERATURE AFTER FUSING IN ELECTROPHOTOGRAPHIC PROCESS Shunsuke Kawasaki1, Shinichi...
View Paper titled, Prediction and Control Technique of the Paper Media Temperature After Fusing in Electrophotographic Process
Click here to open pdf in another window PDF for Prediction and Control Technique of the Paper Media Temperature After Fusing in Electrophotographic Process
Topics: Machine learning, Temperature