1-7 of 7
Keywords: thermal aging
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Paper No: IPACK2022-97452
DOI: https://doi.org/10.1115/IPACK2022-97452
... characteristics of undoped SAC105 and doped SAC-Q solder alloys at low operation temperatures (−65°C to 0°C) at high strain rate after varied thermal aging periods up to one year. In addition, the evolution of Anand parameters for SAC solder alloys after prolonged thermal aging has been studied. The Anand model’s...
View Paper titled, Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
Click here to open pdf in another window PDF for Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Proceedings Papers

Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Paper No: IPACK2022-97427
DOI: https://doi.org/10.1115/IPACK2022-97427
.... isothermal exposure thermal aging cohesive zone modeling interfacial fracture toughness delamination epoxy/PCB interface delamination potting compounds Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems...
View Paper titled, Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure
Click here to open pdf in another window PDF for Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure
Topics: Delamination, Epoxy adhesives, Epoxy resins, High temperature, Modeling
Proceedings Papers

Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures

Pradeep Lall, Aathi Raja Ram Pandurangan, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 25–27, 2022
Paper No: IPACK2022-97424
DOI: https://doi.org/10.1115/IPACK2022-97424
... loading. isothermal exposure FCBGA thermal aging interfacial fracture toughness delamination chip/underfill Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022 October 25-27, 2022...
View Paper titled, Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures
Click here to open pdf in another window PDF for Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures
Topics: Delamination, Fatigue, Fracture toughness, Temperature
Proceedings Papers

Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A021, October 26–28, 2021
Paper No: IPACK2021-74068
DOI: https://doi.org/10.1115/IPACK2021-74068
.... The computed 9 anand parameters were used to verify the accuracy of the Anand model. A good correlation was found between experimental data and Anand predicted data. high strain rate doped solders SAC105 SAC-Q thermal aging Anand viscoplastic model Proceedings of the ASME 2021 International...
View Paper titled, Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage
Click here to open pdf in another window PDF for Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage
Topics: Alloys, High temperature, Low temperature materials, Solders, Storage
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Paper No: IPACK2020-2658
DOI: https://doi.org/10.1115/IPACK2020-2658
... predicted data. high strain rate SAC105 SAC-Q thermal aging Anand viscoplastic model EVOLUTION OF ANAND PARAMETERS WITH ELEVATED TEMPERATURE AGING FOR SAC LEADFREE ALLOYS Pradeep Lall1, Vikas Yadav1, Jeff Suhling1 1Auburn University, NSF-CAVE3 Electronics Research Center, Department...
View Paper titled, Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
Click here to open pdf in another window PDF for Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines
Proceedings Papers

Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

Tusher Ahmed, Mohammad Motalab, Jeffrey C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A024, October 7–9, 2019
Paper No: IPACK2019-6521
DOI: https://doi.org/10.1115/IPACK2019-6521
.... This current investigation deals with the review of mechanical property degradations of SAC305(Sn-96.5Ag-3.0Cu-0.5) solder materials due to thermal aging and their effects on electromigration oriented failure of small scale flip chip solder bumps. Thermal aging causes significant degradation of ultimate...
View Paper titled, Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects
Click here to open pdf in another window PDF for Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects
Topics: Electrodiffusion, Failure, Lead-free solders
Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019
Paper No: IPACK2019-6577
DOI: https://doi.org/10.1115/IPACK2019-6577
.... Temperatures in these applications can exceed 200°C, which is closed to melting point for SAC alloys. The microstructure for lead free solder alloys constantly evolves when subjected to thermal aging for sustained periods with accompanying degradation in mechanical properties of solder alloys. In this paper...
View Paper titled, Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
Click here to open pdf in another window PDF for Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
Topics: Alloys, Temperature, Lead-free solders, Solders, Finite element analysis, Avionics, Constitutive equations, Density, Electronic components, Electronics