Conduction of Heat across Rectangular Cellular Enclosures

[+] Author and Article Information
J. Eftekhar, G. Darkazalli, A. Haji-Sheikh

Mechanical Engineering Department, University of Texas at Arlington, Arlington, Tex.

J. Heat Transfer 103(3), 591-595 (Aug 01, 1981) (5 pages) doi:10.1115/1.3244507 History: Received July 10, 1980; Online October 20, 2009


A simplified analytical model for the computation of thermal conduction across rectangular-celled enclosures based on the assumption of quasi-one-dimensional conduction in the cell partitions is presented. The rectangular enclosures may contain solid or liquid for which the conduction is two or three-dimensional depending on the geometrical configuration. Additional assumptions concerning radiation interchange between participating surfaces are necessary when the enclosure contains a stagnant gas. This analytical model leads to a closed form solution for temperature distribution in the partitions and the multidimensional conductive region. A parametric study of heat flux is presented. The numerical data define a range of parameters for which a one-dimensional conduction model is satisfactory.

Copyright © 1981 by ASME
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In