Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates

[+] Author and Article Information
A. Bar-Cohen

Department of Mechanical Engineering, Ben-Gurion University of the Negev, Beer-Sheva, Israel

W. M. Rohsenow

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Mass. 02139

J. Heat Transfer 106(1), 116-123 (Feb 01, 1984) (8 pages) doi:10.1115/1.3246622 History: Received November 01, 1982; Online October 20, 2009


While component dissipation patterns and system operating modes vary widely, many electronic packaging configurations can be modeled by symmetrically or asymmetrically isothermal or isoflux plates. The idealized configurations are amenable to analytic optimization based on maximizing total heat transfer per unit volume or unit primary area. To achieve this anlaytic optimization, however, it is necessary to develop composite relations for the variation of the heat transfer coefficient along the plate surfaces. The mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of this presentation.

Copyright © 1984 by ASME
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In