TECHNICAL PAPERS: Microscale Heat Transfer

Surface Chemistry and Characteristics Based Model for the Thermal Contact Resistance of Fluidic Interstitial Thermal Interface Materials

[+] Author and Article Information
Ravi S. Prasher

Sr. Packaging Engineer, Assembly Technology Development, CH5-157, Intel Corporation, 5000 W. Chandler Blvd. Chandler, AZ 85226-3699e-mail: ravi.s.prasher@intel.com

J. Heat Transfer 123(5), 969-975 (Feb 27, 2001) (7 pages) doi:10.1115/1.1388301 History: Received August 28, 2000; Revised February 27, 2001
Copyright © 2001 by ASME
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Schematic showing the origin of contact resistance
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(a) Spreading of a liquid or melt on a microscopically smooth solid surface; and (b) liquid/melt interface for notch in the solid/substrate.
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Comparison of the ratio of Anominal and Areal calculated by the exact solution and the approximate solution for different values of ϕ and θ
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(a) Actual measurement of roughness (in μm) on a bead blasted rough block; and (b) modeling of a rough surface as series of notches for the prediction of Rc.
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Comparison of the surface chemistry model with experimental results for Phase change materials
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Comparison of the surface chemistry model with experimental results for Silicon based greases
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Rc of PCM A versus pressure for bead blasted rough blocks
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Ratio of Areal and Anominal obtained through exact solution for different values of ϕ and θ



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