Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics

[+] Author and Article Information
Cristina H. Amon, S.-C. Yao, C.-F. Wu, C.-C. Hsieh

Mechanical Engineering Department, Institute for Complex Engineered Systems, Carnegie Mellon University, 5000 Forbes Avenue, Pittsburgh, PA 15213

J. Heat Transfer 127(1), 66-75 (Feb 15, 2005) (10 pages) doi:10.1115/1.1839586 History: Received May 14, 2004; Revised August 13, 2004; Online February 15, 2005
Copyright © 2005 by ASME
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Performance of the prototype notebook PC evaporative spray cooling system using silicon swiss-roll micronozzles
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Surface texture schematics and images of silicon microstructured surfaces
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Heat transfer results of different surface textures with up-facing surface
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Schematic of EDIFICE and overall system
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Schematics of the test bed
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Nozzle orifice shapes. (a) Circle, (b) square, (c) triangle, (d) medal, (e) cross, (f ) star, (g) V-shaped, (h) H-shaped, (i) I-shaped, (j) cantilever-short, (k) cantilever-median, (l) cantilever-long, (m) rectangle-long, (n) rectangle-median, (o) rectangle-short, (p) dumbbell-long, (q) dumbbell-median and (r) dumbbell-short
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(a) Inlet chip, and (b) swirl chip
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HFE jet breakup length (L/d) of area-equivalent diameter of 100 μm nozzles of axisymmetric shapes. The inset shows a typical liquid jet atomization curve
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Effect of nozzle shapes (a) same hydraulic diameter of 100 μm, 16.0 psig injection pressure, and (b) same hydraulic diameter of 150 μm, 13.1 psig injection pressure
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Effect of swirling for same hydraulic diameter of 150 μm. Injection pressure is 15.3 psig
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Effect of vapor flow on multiple jets and droplets in the vapor chamber
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Schematic of the prototype notebook PC evaporative spray cooling system. Inset shows a swirl silicon nozzle.



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