On the Nature of Critical Heat Flux in Microchannels

[+] Author and Article Information
A. E. Bergles

Mechanical Engineering Department, Massachusetts Institute of Technology, Cambridge, MA 02139 e-mail: abergles@aol.com

S. G. Kandlikar

Mechanical Engineering Department, Rochester Institute of Technology, Rochester, NY 14623 e-mail: sgkeme@rit.edu

J. Heat Transfer 127(1), 101-107 (Feb 15, 2005) (7 pages) doi:10.1115/1.1839587 History: Received May 20, 2004; Revised September 22, 2004; Online February 15, 2005
Copyright © 2005 by ASME
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Grahic Jump Location
Chip with integral cooling channels (see Ref. 4)
Grahic Jump Location
(A) Test-section cross section, (B) Assembly used for local temperature and heat flux measurements in a PFC simulation (see Ref. 16)
Grahic Jump Location
Critical power dependence on total volumetric flow rate (see Ref. 12)
Grahic Jump Location
Sketch of vapor backflow near CHF (see Ref. 26); considered here to be onset of excursive instability
Grahic Jump Location
Flow-rate dependence of subcooled boiling pressure drop for water, used to illustrate excursive instability (see Ref. 29)
Grahic Jump Location
Predictions and data for the pressure drop in a single microchannel (see Ref. 19)



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