Research Papers: Electronic Cooling

Modeling and Validating the Transient Behavior of Flat Miniature Heat Pipes Manufactured in Multilayer Printed Circuit Board Technology

[+] Author and Article Information
Wessel W. Wits

Faculty of Engineering Technology, University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlandsw.w.wits@utwente.nl

Jim B. W. Kok

Faculty of Engineering Technology, University of Twente, P.O. Box 217, 7500 AE Enschede, The Netherlandsj.b.w.kok@utwente.nl

J. Heat Transfer 133(8), 081401 (May 02, 2011) (10 pages) doi:10.1115/1.4003709 History: Received July 21, 2010; Revised February 17, 2011; Published May 02, 2011; Online May 02, 2011

A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB), has been developed, based on mainstream PCB multilayer technology. To accurately predict the thermal performance of this two-phase heat transport device and to establish the operational limitations, a numerical model based on control volume elements is discussed. The advantage of this modular approach, compared with, e.g., finite element models, is that the model can be expanded with additional components (e.g., multiple evaporators) very easily. Actual PCBs with several hot spots cooled by flat miniature heat pipes and their parameter effects can be analyzed very quickly, without the necessity of complex and time-consuming finite element analyses. Experimental verification has shown a good comparison with model predictions. Time evolution analyses show that the developed control volume model is well capable of describing the heat pipe transient behavior.

Copyright © 2011 by American Society of Mechanical Engineers
Topics: Heat pipes , Heat , Vapors
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Figure 1

Schematic layout of a multilayer heat pipe design

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Figure 2

Prototype circuit card assembly with integrated heat pipe: (a) global dimensions and (b) assembled prototype

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Figure 7

Time evolution of heat pipe measurements and predicted values

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Figure 8

Temperature distribution along the length of the heat pipe

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Figure 9

Liquid height in the microgrooves

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Figure 10

Liquid height for two distinct input profiles

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Figure 3

Schematic heat pipe control volume model

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Figure 4

Control volume elements for phase change regions: (a) evaporator, (b) condenser, and (c) fluid flow cross sections

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Figure 5

Overview of heat pipe control volume model

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Figure 6

Measurement set-up for the prototype heat pipe: (a) photograph and (b) schematic



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