Research Papers

Enhanced Pool Boiling With Ethanol at Subatmospheric Pressures for Electronics Cooling

[+] Author and Article Information
Ankit Kalani

e-mail: axk2161@rit.edu

Satish G. Kandlikar

e-mail: sgkeme@rit.edu
ASME Fellow Department of Mechanical Engineering,
Rochester Institute of Technology,
Rochester, NY 14623

1Corresponding author.

2Present address: 76 Lomb Memorial Dr., Rochester Institute of Technology, Rochester, NY, 14623.

Contributed by the Heat Transfer Division of ASME for publication in the Journal of Heat Transfer. Manuscript received March 30, 2012; final manuscript received November 17, 2012; published online September 23, 2013. Assoc. Editor: Sujoy Kumar Saha.

J. Heat Transfer 135(11), 111002 (Sep 23, 2013) (7 pages) Paper No: HT-12-1142; doi: 10.1115/1.4024595 History: Received March 30, 2012; Revised November 17, 2012

The growing trend in miniaturization of electronics has generated a need for efficient thermal management of these devices. Boiling has the ability to dissipate a high heat flux while maintaining a small temperature difference. A vapor chamber with pool boiling offers an effective way to provide cooling and to maintain temperature uniformity. The objective of the current work is to investigate pool boiling performance of ethanol on enhanced microchannel surfaces. Ethanol is an attractive working fluid due to its better heat transfer performance and higher heat of vaporization compared to refrigerants, and lower normal boiling point compared to water. The saturation temperature of ethanol can be further reduced to temperatures suitable for electronics cooling by lowering the pressure. Experiments were performed at four different absolute pressures, 101.3 kPa, 66.7 kPa, 33.3 kPa, and 16.7 kPa using different microchannel surface configurations. Heat dissipation in excess of 900 kW/m2 was obtained while maintaining the wall surface below 85 °C at 33 kPa. Flammability, toxicity, and temperature overshoot issues need to be addressed before practical implementation of ethanol-based cooling systems can occur.

Copyright © 2013 by ASME
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McGillis, W. R., Carey, V. P., Fitch, J. S., and Hamburgen, W. R., 1991, “Pool Boiling Enhancement Techniques for Water at Low Pressure,” 1991 Proceedings, Seventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium, Cat. No.91CH2972-8, pp. 64–72.
Pal, A., and Joshi, Y., 2008, “Boiling of Water at Sub-Atmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume,” ASME J. of Elect. Packag., 130(1), p. 011010. [CrossRef]
Cooke, D., and Kandlikar, S. G., 2012, “Effect of Open Microchannel Geometry on Pool Boiling Enhancement,” Int. J. Heat Mass Transfer, 55(4), pp. 1004–1013. [CrossRef]
Ahn, H. S., Lee, C., Kim, H., Jo, H., Kang, S., Kim, J., Shin, J., and Kim, M. H., 2010, “Pool Boiling CHF Enhancement by Micro/Nanoscale Modification of Zircaloy-4 Surface,” Nucl. Eng. Des., 240(10), pp. 3350–3360. [CrossRef]
Sloan, A., Penley, S., and Wirtz, R. A., 2009, “Sub-Atmospheric Pressure Pool Boiling of Water on a Screen-Laminate Enhanced Surface,” 2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, p. 8.
Das, A. K., Das, P. K., and Saha, P., 2009, “Performance of Different Structured Surfaces in Nucleate Pool Boiling,” Appl. Therm. Eng., 29(17–18), pp. 3643–3653. [CrossRef]
Yao, Z., Lu, Y.-W., and Kandlikar, S. G., 2011, “Effects of Nanowire Height on Pool Boiling Performance of Water on Silicon Chips,” Int. J. Therm. Sci., 50(11), pp. 2084–2090. [CrossRef]
Kwark, S. M., Amaya, M., Kumar, R., Moreno, G., and You, S. M., 2010, “Effects of Pressure, Orientation, and Heater Size on Pool Boiling of Water With Nanocoated Heaters,” Int. J. Heat Mass Transfer, 53(23–24), pp. 5199–5208. [CrossRef]
Chan, M. A., Yap, C. R., and Kim Choon, N., 2010, “Pool Boiling Heat Transfer of Water on Finned Surfaces at Near Vacuum Pressures,” ASME J. Heat Transfer, 132(3), p. 031501. [CrossRef]
Anderson, T. M., and Mudawar, I., 1989, “Microelectronic Cooling by Enhanced Pool Boiling of a Dielectric Fluorocarbon Liquid,” ASME J. Heat Transfer, 111(3), pp. 752–759. [CrossRef]
Rainey, K. N., You, S. M., and Lee, S., 2003, “Effect of Pressure, Subcooling, and Dissolved Gas on Pool Boiling Heat Transfer From Microporous, Square Pin-Finned Surfaces in FC-72,” Int. J. Heat Mass Transfer, 46(1), pp. 23–35. [CrossRef]
Kim, J. H., Kashinath, M. R., Kwark, S. M., and You, S. M., 2007, “Optimization of Microporous Structures in Enhancing Pool Boiling Heat Transfer of Saturated R-123, FC-72 and Water,” Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference 2007, 3, pp. 349–356.
Arik, M., and Bar-Cohen, A., 2010, “Pool Boiling of Perfluorocarbon Mixtures on Silicon Surfaces,” Int J. Heat Mass Transfer, 53(23–24), pp. 5596–5604. [CrossRef]
Guglielmini, G., Misale, M., and Schenone, C., 2002, “Boiling of Saturated FC-72 on Square Pin Fin Arrays,” Int. J. Therm. Sci., 41(7), pp. 599–608. [CrossRef]
Honda, H., and Wei, J. J., 2004, “Enhanced Boiling Heat Transfer From Electronic Components by Use of Surface Microstructures,” Exp. Therm. Fluid Sci., 28(2–3), pp. 159–169. [CrossRef]
Kubo, H., Takamatsu, H., and HondaH., 1999, “Effects of Size and Number Density of Micro-Reentrant Cavities on Boiling Heat Transfer From a Silicon Chip Immersed in Degassed and Gas-Dissolved FC-72,” J. Enhanced Heat Transfer, 16, pp. 151–160.
Nishikawa, K., Fujita, Y., Nawata, Y., and Nishijima, T., 1976, “Studies on Nucleate Pool Boiling at Low Pressures,” Heat Transfer—Jpn. Res., 5(2), pp. 66–89.
McGillis, W. R., Carey, V. P., Fitch, J. S., and Hamburgen, W. R., 1992, “Boiling Binary Mixtures at Subatmospheric Pressures,” InterSociety Conference on Thermal Phenomena in Electronic Systems. I-THERM III, Cat. No.92CH3096-5, pp. 127–136.
Sakashita, H., Ono, A., and Nakabayashi, Y., 2010, “Measurements of Critical Heat Flux and Liquid–Vapor Structure Near the Heating Surface in Pool Boiling of 2-Propanol/Water Mixtures,” Int. J. Heat Mass Transfer, 53(7–8), pp. 1554–1562. [CrossRef]
Bailey, W., Young, E., Beduz, C., and Yang, Y., 2006, “Pool Boiling Study on Candidature of Pentane, Methanol and Water for Near Room Temperature Cooling,” The Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems, ITHERM '06, pp. 599–603.
Warrier, P., Sathyanarayana, A., Joshi, Y., and Teja, A. S., 2011, “Screening and Evaluation of Mixture Formulations for Electronics Thermal Management Using Pool Boiling,” IEEE Trans. Compon., Packag. Manuf. Technol., 1(9), pp. 1387–1394. [CrossRef]
Pastuszko, R., 2012, “Pool Boiling for Extended Surfaces With Narrow Tunnels—Visualization and a Simplified Model,” Exp. Therm. Fluid Sci., 38, pp. 149–164. [CrossRef]
Cooke, D., and Kandlikar, S. G., 2011, “Pool Boiling Heat Transfer and Bubble Dynamics Over Plain and Enhanced Microchannels,” ASME J. Heat Transfer, 133(5), p. 052902. [CrossRef]
Kandlikar, S. G., 1991, “Development of a Flow Boiling Map for Subcooled and Saturated Flow Boiling of Different Fluids in Circular Tubes,” ASME J. Heat Transfer, 113(1), pp. 190–200. [CrossRef]


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Fig. 1

Schematic of the pool boiling test setup

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Fig. 2

Schematic of the heater assembly

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Fig. 3

Copper test section with microchannels

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Fig. 4

Boiling curves for a plain chip with ethanol and FC-87 at atmospheric pressure

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Fig. 5

Boiling curves of plain chip for ethanol for pressures of 101.3 kPa, 66.7 kPa, 33.3 kPa, and 16.7 kPa

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Fig. 6

Boiling curves of microchannel enhanced surfaces chip for ethanol at different pressures: (a) chip 1, (b) chip 2, (c) chip 3, and (d) chip 4

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Fig. 7

Heat transfer coefficients for the tested chips at atmospheric pressure

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Fig. 8

Heat transfer coefficients for chips 1 and 3 at 101.3 kPa and 66.7 kPa

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Fig. 9

Boiling curve after ONB for chip 1 for pressures of 101.3 kPa, 66.7 kPa, 33.3 kPa, and 16.7 kPa plotted with heat flux as a function of chip surface temperature



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