Technical Brief

Orthogonal Eigenfunction Expansion Method for One-Dimensional Dual-Phase Lag Heat Conduction Problem With Time-Dependent Boundary Conditions

[+] Author and Article Information
Pranay Biswas

Department of Energy Science and Engineering,
Indian Institute of Technology Bombay, Powai,
Mumbai 400076, Maharashtra, India
e-mail: pranaybiswas@iitb.ac.in

Suneet Singh

Department of Energy Science and Engineering,
Indian Institute of Technology Bombay, Powai,
Mumbai 400076, Maharashtra, India
e-mail: suneet.singh@iitb.ac.in

1Corresponding author.

Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received December 15, 2016; final manuscript received July 25, 2017; published online October 10, 2017. Assoc. Editor: Milind A. Jog.

J. Heat Transfer 140(3), 034501 (Oct 10, 2017) (6 pages) Paper No: HT-16-1813; doi: 10.1115/1.4037874 History: Received December 15, 2016; Revised July 25, 2017

The separation of variables (SOV) can be used for all Fourier, single-phase lag (SPL), and dual-phase lag (DPL) heat conduction problems with time-independent source and/or boundary conditions (BCs). The Laplace transform (LT) can be used for problems with time-dependent BCs and sources but requires large computational time for inverse LT. In this work, the orthogonal eigenfunction expansion (OEEM) has been proposed as an alternate method for non-Fourier (SPL and DPL) heat conduction problem. However, the OEEM is applicable only for cases where BCs are homogeneous. Therefore, BCs of the original problem are homogenized by subtracting an auxiliary function from the temperature to get a modified problem in terms of a modified temperature. It is shown that the auxiliary function has to satisfy a set of conditions. However, these conditions do not lead to a unique auxiliary function. Therefore, an additional condition, which simplifies the modified problem, is proposed to evaluate the auxiliary function. The methodology is verified with SOV for time-independent BCs. The implementation of the methodology is demonstrated with illustrative example, which shows that this approach leads to an accurate solution with reasonable number of terms in the expansion.

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Grahic Jump Location
Fig. 1

Temperature distributions for Fourier and non-Fourier (SPL and DPL) heat conduction obtained by SOV (dashed lines) and OEEM (solid lines) with constant temperature [f(t)=1] applied at both inner (r=r0) and outer (r=r1) boundaries for cylindrical coordinates (p=1)

Grahic Jump Location
Fig. 2

Temperature profiles of Fourier and non-Fourier (SPL and DPL) heat conduction obtained by OEEM with constant [f(t)=1] and time-dependent [f(t)=1+sin t] temperature applied at both inner (r=r0) and outer (r=r1) boundaries for cylindrical coordinates (p=1). Solid lines: profiles for constant boundary temperatures; dashed lines: profiles for time-dependent boundary temperatures.



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