The relationships between the force measured during wetting balance tests and the observed changes of contact angle and meniscus shape are studied. Experiments using silicone oil at 25, 50, and 100°C on glass plates as well as Pb-Sn eutectic solder on Au-coated glass plates are reported. Discrepancies between the measured force and height and those expected for a static meniscus are detailed. Equilibrium meniscus shapes are computed for wide plates using the elastica solution and for narrow plates using the public-domain software package, “Surface Evolver.” For room temperature experiments with oil, the measured force discrepancy disappears when the meniscus rise is complete. Thus, the force discrepancy may be due to shear stress exerted on the sample by fluid rising up the sample. For static menisci with heated liquids, force and meniscus height discrepancies do not disappear when the meniscus rise is complete. These discrepancies can be explained by Marangoni flow due to temperature gradients in the fluid for the oil experiments but not for the solder experiments.
Skip Nav Destination
Article navigation
September 1996
Technical Papers
Dynamic Aspects of Wetting Balance Tests
K. W. Moon,
K. W. Moon
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
Search for other works by this author on:
W. J. Boettinger,
W. J. Boettinger
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
Search for other works by this author on:
M. E. Williams,
M. E. Williams
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
Search for other works by this author on:
D. Josell,
D. Josell
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
Search for other works by this author on:
B. T. Murray,
B. T. Murray
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
Search for other works by this author on:
W. C. Carter,
W. C. Carter
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
Search for other works by this author on:
C. A. Handwerker
C. A. Handwerker
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
Search for other works by this author on:
K. W. Moon
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
W. J. Boettinger
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
M. E. Williams
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
D. Josell
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
B. T. Murray
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
W. C. Carter
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
C. A. Handwerker
Metallurgy Division, Applied and Computational Mathematics Division, NIST, Gaithersburg, MD 20899
J. Electron. Packag. Sep 1996, 118(3): 174-183 (10 pages)
Published Online: September 1, 1996
Article history
Received:
March 27, 1996
Revised:
June 24, 1996
Online:
November 6, 2007
Citation
Moon, K. W., Boettinger, W. J., Williams, M. E., Josell, D., Murray, B. T., Carter, W. C., and Handwerker, C. A. (September 1, 1996). "Dynamic Aspects of Wetting Balance Tests." ASME. J. Electron. Packag. September 1996; 118(3): 174–183. https://doi.org/10.1115/1.2792149
Download citation file:
Get Email Alerts
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Related Articles
Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates
J. Electron. Packag (December,2010)
Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change
J. Electron. Packag (December,2011)
The Effects of Wetting and Surface Roughness on Liquid Metal Droplet Bouncing
J. Manuf. Sci. Eng (April,2009)
Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties
J. Electron. Packag (March,2009)
Related Proceedings Papers
Related Chapters
Pool Boiling
Thermal Management of Microelectronic Equipment, Second Edition
The ‘Regenerator Problem’
Air Engines: The History, Science, and Reality of the Perfect Engine
Numerical Simulation Research on a Fixed Bed Gasifier
International Conference on Information Technology and Management Engineering (ITME 2011)