Much research has been done on Surface Mount Technology (SMT) using the Finite Element Method (FEM). Little of this, however, has employed fracture mechanics and/or continuum damage mechanics. In this study, we propose two finite element approaches incorporating fracture mechanics and continuum damage mechanics to predict time-dependent and temperature-dependent fatigue life of solder joints. For fracture mechanics, the J-integral fatigue formula, da/dN = C(δJ)m, is used to quantify fatigue crack growth and the fatigue life of J-leaded solder joints. For continuum damage mechanics, the anisotropic creep-fatigue damage formula with partially reversible damage effects is used to find the initial crack, crack growth path, and fatigue life of solder joints. The concept of partially reversible damage is especially novel and, based on laboratory tests we have conducted, appears to be necessary for solder joints undergoing cyclic loading. Both of these methods are adequate to predict the fatigue life of solder joints. The advantage of the fracture mechanics approach is that little computer time is required. The disadvantage is that assumptions must be made on the initial crack position and the crack growth path. The advantage of continuum damage mechanics is that the initial crack and its growth path are automatically evaluated, with the temporary disadvantage of requiring a lot of computer time.
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December 1996
Technical Papers
Life Prediction of Solder Joints by Damage and Fracture Mechanics
S. H. Ju,
S. H. Ju
Dept. of Civil Engineering, National Cheng Kung University, Tainan, Taiwan, R.O.C
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B. I. Sandor,
B. I. Sandor
Engineering Mechanics and Astronautics Program, Dept. of Nuclear Engr. and Engineering Physics, University of Wisconsin, Madison, WI 53706
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M. E. Plesha
M. E. Plesha
Engineering Mechanics and Astronautics Program, Dept. of Nuclear Engr. and Engineering Physics, University of Wisconsin, Madison, WI 53706
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S. H. Ju
Dept. of Civil Engineering, National Cheng Kung University, Tainan, Taiwan, R.O.C
B. I. Sandor
Engineering Mechanics and Astronautics Program, Dept. of Nuclear Engr. and Engineering Physics, University of Wisconsin, Madison, WI 53706
M. E. Plesha
Engineering Mechanics and Astronautics Program, Dept. of Nuclear Engr. and Engineering Physics, University of Wisconsin, Madison, WI 53706
J. Electron. Packag. Dec 1996, 118(4): 193-200 (8 pages)
Published Online: December 1, 1996
Article history
Received:
November 1, 1996
Revised:
November 11, 1996
Online:
December 5, 2007
Citation
Ju, S. H., Sandor, B. I., and Plesha, M. E. (December 1, 1996). "Life Prediction of Solder Joints by Damage and Fracture Mechanics." ASME. J. Electron. Packag. December 1996; 118(4): 193–200. https://doi.org/10.1115/1.2792152
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