A damage coupling framework is proposed with a unified viscoplastic constitutive model for the fatigue life prediction of solder alloys, including a consistent and systematic procedure for the determination of material parameters. The model also incorporates the effects of grain size and cyclic hardening/softening. The phenomenological framework of continuum damage mechanics (CDM) is modified to embed intensive researches on the ductile damage fracture by void nucleation, growth, and coalescence, based on a lower bound for the viscoplastic potential of voided materials. The damage coupling with elasticity and viscoplasticity is formulated by irreversible thermodynamic approach. The constitutive model is also extended to large deformation kinematics. The preliminary application of the model to creep damage is presented.
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e-mail: sliueeng.wayne.edu
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September 1999
Technical Papers
A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys
Z. Qian,
Z. Qian
Electronic Packaging Laboratory, Department of Mechanical Engineering, Wayne State University, Detroit, MI 48202
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W. Ren,
W. Ren
Electronic Packaging Laboratory, Department of Mechanical Engineering, Wayne State University, Detroit, MI 48202
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S. Liu
S. Liu
Electronic Packaging Laboratory, Department of Mechanical Engineering, Wayne State University, Detroit, MI 48202
e-mail: sliueeng.wayne.edu
Search for other works by this author on:
Z. Qian
Electronic Packaging Laboratory, Department of Mechanical Engineering, Wayne State University, Detroit, MI 48202
W. Ren
Electronic Packaging Laboratory, Department of Mechanical Engineering, Wayne State University, Detroit, MI 48202
S. Liu
Electronic Packaging Laboratory, Department of Mechanical Engineering, Wayne State University, Detroit, MI 48202
e-mail: sliueeng.wayne.edu
J. Electron. Packag. Sep 1999, 121(3): 162-168 (7 pages)
Published Online: September 1, 1999
Article history
Received:
January 1, 1998
Revised:
May 3, 1999
Online:
November 5, 2007
Citation
Qian, Z., Ren, W., and Liu, S. (September 1, 1999). "A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys." ASME. J. Electron. Packag. September 1999; 121(3): 162–168. https://doi.org/10.1115/1.2792679
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