Isotropic conductive adhesives (ICA) have been considered as replacement materials for lead-tin solder alloys. In this paper, the post-impact shear strength of ICA surface mount (SM) joints was obtained experimentally and compared with that of SM lead-tin joints. The dynamic impact energy was provided in the form of three-point bending on the PCB using equipment called the split Hopkinson bar. Strain rates of over 4000/s were used for the impact bending test. The action of impact bending was used to simulate the effect on the PCB and the interconnection as a result of high energy impact on an electronic equipment. Shear test was then performed to examine the change in strength of the ICA joints as a result of impact damage. It was found that the SM ICA joints failed due to impact at a strain rate just over 4000/s. Microstructural examination carried out using a scanning electron microscope revealed that the interface between the ICA and copper pad on the PCB was the weakest region of the joint.
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e-mail: Lawrence.Wu@cityu.edu.hk
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March 2003
Technical Papers
Impact Resistance of SM Joints Formed With ICA
C. M. Lawrence Wu,
e-mail: Lawrence.Wu@cityu.edu.hk
C. M. Lawrence Wu
Department of Physics and Materials Science, City University of Hong Kong, Hong Kong
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Robert K. Y. Li,
Robert K. Y. Li
Department of Physics and Materials Science, City University of Hong Kong, Hong Kong
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N. H. Yeung
N. H. Yeung
Department of Physics and Materials Science, City University of Hong Kong, Hong Kong
Search for other works by this author on:
C. M. Lawrence Wu
Department of Physics and Materials Science, City University of Hong Kong, Hong Kong
e-mail: Lawrence.Wu@cityu.edu.hk
Robert K. Y. Li
Department of Physics and Materials Science, City University of Hong Kong, Hong Kong
N. H. Yeung
Department of Physics and Materials Science, City University of Hong Kong, Hong Kong
Contributed by the Electronic and Photonic Packaging Division and presented at Poly 2000, London, United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel.
J. Electron. Packag. Mar 2003, 125(1): 93-97 (5 pages)
Published Online: March 14, 2003
Article history
Received:
May 1, 2002
Online:
March 14, 2003
Citation
Wu, C. M. L., Li , R. K. Y., and Yeung, N. H. (March 14, 2003). "Impact Resistance of SM Joints Formed With ICA ." ASME. J. Electron. Packag. March 2003; 125(1): 93–97. https://doi.org/10.1115/1.1534842
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