This paper introduces a simplified modeling scheme for the prediction of heat transport capability of heat pipes and vapor chambers. The modeling scheme introduced in this paper enables thermal designers to model heat pipes and vapor chambers in commercially available conduction modeling tools such as Ansys™ and IcePak™. This modeling scheme allows thermal designers to perform design sensitivity studies in terms of power dissipation of heat pipes and vapor chambers for different scenarios such as configurations, heat sink resistance for a given temperature drop between the heating source and the ambient. This paper also discusses how thermal designers can specify requirements to heat pipe/vapor chamber suppliers for their thermal design, without delving into the complete thermo-fluidic modeling of this technology.
A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received Sept. 2001; final revision, March 2002. Associate Editor: A. Y.-H. Hung.
Prasher, R. S. (September 17, 2003). "A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology ." ASME. J. Electron. Packag. September 2003; 125(3): 378–385. https://doi.org/10.1115/1.1602479
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