There has been steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. Simple processing, low processing temperature and fine pitch capability are the major advantages of conducting adhesive technology. A new and innovative connection technology geared towards achieving increased functionality at a lower total system cost is anisotropic conductive adhesive (ACA) interconnection. ACAs, when used for flip chip assembly, provide electrical as well as mechanical interconnections for fine pitch applications. This work deals with adhesion issues between ACA on polyimide materials. The paper presents a reliability assessment of adhesive joints using ACA on polyimide substrate that was conducted by testing samples at various aging temperature, high humidity and high pressure environments. The effects of high temperature and high humidity on the bond strength of ACA joints were measured using 90 deg peel test as well as by microstructural examination. It was found that aging generally caused a decrease in peel strength, especially the results of scanning electronic microscopy showed that the pressure cooker test could most effectively reveal the adhesion behavior.
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March 2005
Article
Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate
Liqiang Cao,
e-mail: caoliqiang@yahoo.com
Liqiang Cao
Swedish Microsystem Integration Technology Centre (SMIT), and Division of Electronic Production, School of Mechanical Engineering, Chalmers University of Technology, SE-431 53 Mo¨ndal, Sweden
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Zonghe Lai,
Zonghe Lai
Swedish Microsystem Integration Technology Centre (SMIT), and Division of Electronic Production, School of Mechanical Engineering, Chalmers University of Technology, SE-431 53 Mo¨ndal, Sweden
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Johan Liu
Johan Liu
Swedish Microsystem Integration Technology Centre (SMIT), and Division of Electronic Production, School of Mechanical Engineering, Chalmers University of Technology, SE-431 53 Mo¨ndal, Sweden
Search for other works by this author on:
Liqiang Cao
Swedish Microsystem Integration Technology Centre (SMIT), and Division of Electronic Production, School of Mechanical Engineering, Chalmers University of Technology, SE-431 53 Mo¨ndal, Sweden
e-mail: caoliqiang@yahoo.com
Zonghe Lai
Swedish Microsystem Integration Technology Centre (SMIT), and Division of Electronic Production, School of Mechanical Engineering, Chalmers University of Technology, SE-431 53 Mo¨ndal, Sweden
Johan Liu
Swedish Microsystem Integration Technology Centre (SMIT), and Division of Electronic Production, School of Mechanical Engineering, Chalmers University of Technology, SE-431 53 Mo¨ndal, Sweden
Manuscript received January 13, 2004; revision received November 10, 2004. Review conducted by: Y. C. Chan.
J. Electron. Packag. Mar 2005, 127(1): 43-46 (4 pages)
Published Online: March 21, 2005
Article history
Received:
January 13, 2004
Revised:
November 10, 2004
Online:
March 21, 2005
Citation
Cao, L., Lai , Z., and Liu, J. (March 21, 2005). "Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate ." ASME. J. Electron. Packag. March 2005; 127(1): 43–46. https://doi.org/10.1115/1.1846066
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