In many applications such as computers and telecommunications, the IC chip sizes are very big, the on-chip frequency and power dissipation are very high, and the number of chip I/Os is very large. The CCGA (ceramic column grid array) package developed by IBM is one of the best candidates for housing these kinds of chips. There are two parts in this study. One is to show that the two-parameter Weibull life distribution is adequate for modeling the thermal-fatigue life of lead-free solder joints. This is demonstrated by comparing the two-parameter and three-parameter Weibull distributions with life test data of an 1657-pin CCGA package with the 95.5 wt %Sn3.9 wt %Ag0.6 wt %Cu lead-free solder paste on lead-free printed circuit boards under thermal cycling conditions. The other part of this study is to determine the time-history creep strain energy density of the 1657-pin CCGA solder column with two different solder paste materials, namely, 95.5 wt %Sn3.9 wt %Ag0.6 wt %Cu and 63 wt %Sn37 wt %Pb and under three different thermal cycling profiles, namely, 25↔75°C, 0↔100°C, and −25↔125°C. The effects of these solder pastes and temperature conditions on the thermal-fatigue life of the high-lead (10 wt %Sn90 wt %Pb) solder columns of the CCGA package are provided and discussed.

Issue Section:
Research Papers
Keywords:
ceramic packaging, strain ageing, chip-on-board packaging, integrated circuit packaging, integrated circuit reliability, integrated circuit interconnections, printed circuits, solders, thermal stress cracking, Weibull distribution, life testing, creep, internal stresses
Topics:
Ceramics, Creep, Cycles, Lead-free solders, Reliability, Solders, Temperature, Printed circuit boards, Fatigue, Weibull distribution, Density
1.
Mann, N., Schafer, R., and Singpurwalla, N., 1974, Methods for Statistical Analysis of Reliability and Life Data, Wiley, New York.
2.
Barlow, R., and Proschan, F., 1974, Statistical Theory of Reliability and Life Testing, Holt, Reinhart and Winston, New York.
3.
Little, R., and Jebe, E., 1975, Statistical Design of Fatigue Experiments (Applied Science).
4.
Smetana, J., Horsley, R., Lau, J., Snowdon, K., Shangguan, D., Gleason, J., Memis, I., Love, D., Dauksher, W., and Sullivan, B., 2003, “Lead-Free Design, Materials, and Process of High Density Packages,” Proc. APEX, Anaheim, CA, CD-ROM.
5.
Lau, J., Dauksher, W., Smetana, J., Horsley, R., Shangguan, D., Castello, T., Memis, I., Love, D., and Sullivan, B., 2003, “Design for Lead-Free Solder Joints Reliability of High-Density Packages,” Proc. APEX, Anaheim, CA, CD-ROM.
6.
Lau, J., Hoo, N., Horsley, R., Smetana, J., Shangguan, D., Dauksher, W., Love, D., Menis, I., and Sullivan, B., 2003, “Reliability Test and Data Analysis of High-Density Packages’ Lead-Free Solder Joints,” Proc. APEX, Anaheim, CA, CD-ROM.
7.
Lau, J., Shangguan, D., Castello, T., Horsley, R., Smetana, J., Dauksher, W., Love, D., Memis, I., and Sullivan, B., 2003, “Failure Analysis of High-Density Packages’ Lead-Free Solder Joints,” Proc. APEX, Anaheim, CA, CD-ROM.
8.
ANSYS, User’s Manual, Release 6.1, 2002.
9.
Vianco, P., and Rejent, J., 2002, “Compression Deformation Response of 95.5Sn-3.9Ag-0.6Cu Solder,” UCLA Lead-Free Workshop.
10.
Lau, J. H., Dauksher, W., and Vianco, P., 2003, “Acceleration Models, Constitutive Equations, and Reliability of Lead-Free Solders,” IEEE Proc. Electronic Components & Technology Conference, pp. 229–236.
11.
Lau, J. H., and Pao, Y., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY.
12.
Morrow, J., 1965, “Cyclic Plastic Strain Energy and Fatigue of Metals,” ASTM STP-378, pp. 45–87.
13.
Lau
,
J. H.
,
Mei
,
Z.
,
Pang
,
S.
,
Amsden
,
C.
,
Rayner
,
J.
, and
Pan
,
S.
,
2002
, “
Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch
,”
ASME Trans., J. Electron. Packaging
,
124
, pp.
403
–
410
.
14.
Cole, M., DeSousa, I., Interrante, M., Jozwiak, J., June, M., Martin, G., Milkovich, C., Ross, J., and Shannon, M., 2001, “The New Millennium for CCGA—Beyond 2000 I/O,” Proc. SMI, Chicago, IL, pp. 297–306.
15.
Caulfield, T., Cole, M., Cappo, F., Zitz, J., and Benenati, J., 1995, “An Overview of Ceramic Ball and Column Grid Array Packaging,” in Ball Grid Array Technology, J. Lau, ed., McGraw-Hill, New York, pp. 131–169.
16.
Banks, D., Hoebener, K., and Viswanadham, P., 1995, “Ceramic Ball Grid Array Assembly,” in Ref. 2, pp. 171–192.
17.
Master, R., Cole, M., and Martin, G., 1995, “Ceramic Column Grid Array for Flip Chip Applications,” IEEE Proc. Electronic Components & Technology Conference, pp. 925–929.
18.
Ray, S. et al., 1997, “Ceramic Column Grid Array for a High Performance Workstation Application,” IEEE Proc. Electronic Components & Technology Conference, pp. 319–324.
19.
Ray, S. et al., 1999, “CLASP Ceramic Column Grid Array Technology for Flip Chip Carriers,” Proc. SEMICON West, pp. 1–7.
20.
Interrante, M. J. et al., 2002, “High Density Column Grid Array Connections and Method Thereof,” US Patent No. 6,429,388.
Copyright © 2005
 by ASME
You do not currently have access to this content.