Sn-Pb eutectic solder alloy is extensively used in microelectronics packaging interconnects. Due to the high homologous temperature, eutectic Sn-Pb solder exhibits creep-fatigue interaction and significant time-, temperature-, stress-, and rate-dependent material characteristics. The microstructure is often unstable, having significant effects on the flow behavior of solder joints at high homologous temperatures. Such complex behavior makes constitutive modeling an extremely difficult task. A viscoplasticity model unified with a thermodynamics-based damage concept is presented. The proposed model takes into account isotropic and kinematic hardening, and grain size coarsening evolution. The model is verified against various test data, and shows strong application potential for modeling thermal viscoplastic behavior and fatigue life of solder joints in microelectronics packaging.
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September 2005
Research Papers
A Damage-Mechanics-Based Constitutive Model for Solder Joints
Y. Zhao,
Y. Zhao
Senior Engineer
Analog Devices
, Boston, MA
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H. Tang,
H. Tang
Senior Engineer
NEC Honda Electronics
, Detroit, MI
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J. Gomez
J. Gomez
Graduate Student
University at Buffalo
, Buffalo, NY
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C. Basaran
Professor, and Director
Y. Zhao
Senior Engineer
Analog Devices
, Boston, MA
H. Tang
Senior Engineer
NEC Honda Electronics
, Detroit, MI
J. Gomez
Graduate Student
University at Buffalo
, Buffalo, NYJ. Electron. Packag. Sep 2005, 127(3): 208-214 (7 pages)
Published Online: July 23, 2004
Article history
Received:
June 28, 2004
Revised:
July 23, 2004
Citation
Basaran, C., Zhao, Y., Tang, H., and Gomez, J. (July 23, 2004). "A Damage-Mechanics-Based Constitutive Model for Solder Joints." ASME. J. Electron. Packag. September 2005; 127(3): 208–214. https://doi.org/10.1115/1.1939822
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