The optimal arrangement of various components in a standard data processing cabinet layout is investigated through computational fluid dynamics and heat transfer. Relevant heat transfer performance of candidate designs is measured by newly proposed metrics for systems level electronics cooling. The results are then extended to define a favorable power dissipation profile, the most favorable of which was found to be one where the power dissipation increases in the vertical direction.

Issue Section:
Research Papers
Keywords:
file servers, forced convection, computational fluid dynamics, thermal management (packaging), integrated circuit packaging, cooling
Topics:
Air flow, Blades, Computational fluid dynamics, Cooling, Energy dissipation, Entropy, Flow (Dynamics), Temperature, Thermal management, Heat, Thermal resistance, Heat transfer, Turbulence, Computer cooling, Exhaust systems, Forced convection, Design, Geometry
1.
The Uptime Institute, 2000, “
Heat Density Trends in Data Processing, Computer Systems and Telecommunications Equipment
,” whitepaper issued by
The Uptime Institute
, http:∕∕www.upsite.com∕TUIpages∕tuiwhite.htmlhttp:∕∕www.upsite.com∕TUIpages∕tuiwhite.html.
2.
Patel
,
C. D.
,
Bash
,
C. E.
,
Belady
,
C.
,
Stahl
,
L.
, and
Sullivan
,
D.
, 2001, “
Computational Fluid Dynamics Modeling of High Compute Density Data Centers to Assure System Inlet Air Specifications
,”
Proc. IPACK’01-The Pacific Rim∕ASME International Electronics Packaging Technical Conference and Exhibition
,
Kauai
, Hawaii.
3.
Zimmerman
,
E.
, and
Colwell
,
G.
, 1996, “
Transient Modeling of the Thermal Behavior of Outdoor Electronic Cabinets
,”
J. Electron. Packag.
1043-7398,
118
(
4
), pp.
258
–
263
.
Crossref
Search ADS
 
4.
Zimmerman
,
E.
,
Hegab
,
H.
, and
Colwell
,
G.
, 1999, “
Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates
,”
J. Electron. Packag.
1043-7398,
121
(
1
), pp.
50
–
54
.
Crossref
Search ADS
 
5.
Hegab
,
H.
,
Zimmerman
,
E.
, and
Colwell
,
G.
, 2002, “
Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers
,”
J. Electron. Packag.
1043-7398,
124
(
1
), pp.
7
–
11
.
Crossref
Search ADS
 
6.
Parry
,
J. D.
, and
Tatchell
,
D. G.
, 1993, “
Thermal Analysis of a Telecommunications Rack System
,”
Proceedings of EuroTHERM Seminar 29
, June 14–16,
Delft
, Netherlands.
7.
Iwasaki
,
H.
, and
Ishizuka
,
M.
, 1998, “
Natural Convection Air Cooling Characteristics of Plate Fins in a Ventilated Electronic Cabinet
,”
Proceedings of ITHERM 1998-Eight Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
,
Seattle
, Washington, pp.
124
–
129
.
8.
Refai-Ahmed
,
G.
,
Radmehr
,
A.
, and
Kelkar
,
K. M.
, 2000, “
Analysis of Flow Distribution in a Power Supply Using Flow Network Modeling (FNM)
,”
Proceedings of ITHERM 200-Eight Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
,
Las Vegas
, Nevada, pp.
90
–
98
.
9.
Launder
,
B. E.
, and
Spalding
,
D. B.
, 1972,
Lectures in Mathematical Models of Turbulence
,
Academic
, London, England.
10.
Molki
,
M.
,
Faghri
,
M.
, and
Ozbay
,
O.
, 1995, “
Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components
,”
J. Heat Transfer
0022-1481,
117
(
1
), pp.
40
–
46
.
Crossref
Search ADS
 
11.
Fluent v. 6.1 Users Manual
, 2001, Fluent Incorporated, Lebanon, New Hampshire.
12.
Patankar
,
S. V.
, 1980,
Numerical Heat Transfer and Fluid Flow
,
McGraw-Hill
, New York.
13.
Bejan
,
A.
, 1996,
Entropy Generation Minimization
,
CRC Press
, New York.
14.
Pope
,
S. B.
, 2000,
Turbulent Flows
,
Cambridge University Press
, New York.
15.
Wilcox
,
D. C.
, 2000,
Turbulence Modeling for CFD
,
2nd ed.
,
DCW Industries
, California.
Copyright © 2005
 by American Society of Mechanical Engineers
You do not currently have access to this content.