Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we present reliability investigations on an encapsulated ICA flip chip interconnection. Experimental work included product lifetime measurement, cross section observation, and whole module warpage scanning. Results revealed that the chip-size effect on the ICA lifetime was obvious. A theoretical analysis was conducted with Finite Element Method (FEM) simulation. Viscoelastic models for adhesives and underfill materials were employed, and the comparison with an elastic model was made. Calculated equivalent stresses and shear stress fitted well with the experimental lifetime measurement, thus a lifetime relationship similar to the Coffin-Manson formula was established to predict the thermal fatigue life of an encapsulated ICA flip chip. Furthermore, the influences of underfill properties on the ICA reliability were discussed.
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e-mail: caroline.chen@mc2.chalmers.se
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September 2006
Research Papers
Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Liu Caroline Chen,
Liu Caroline Chen
Swedish Microsystem Integration Technology (SMIT) Center & Electronics Production, Department of Microtechnology and Nanoscience,
e-mail: caroline.chen@mc2.chalmers.se
Chalmers University of Technology
, Kemivagen 9, 412 96 Gothenburg, Sweden
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Zonghe Lai,
Zonghe Lai
Swedish Microsystem Integration Technology (SMIT) Center & Electronics Production, Department of Microtechnology and Nanoscience,
Chalmers University of Technology
, Kemivagen 9, 412 96 Gothenburg, Sweden
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Zhaonian Cheng,
Zhaonian Cheng
Swedish Microsystem Integration Technology (SMIT) Center & Electronics Production, Department of Microtechnology and Nanoscience,
Chalmers University of Technology
, Kemivagen 9, 412 96 Gothenburg, Sweden
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Johan Liu
Johan Liu
Swedish Microsystem Integration Technology (SMIT) Center & Electronics Production, Department of Microtechnology and Nanoscience,
Chalmers University of Technology
, Kemivagen 9, 412 96 Gothenburg, Sweden
Search for other works by this author on:
Liu Caroline Chen
Swedish Microsystem Integration Technology (SMIT) Center & Electronics Production, Department of Microtechnology and Nanoscience,
Chalmers University of Technology
, Kemivagen 9, 412 96 Gothenburg, Swedene-mail: caroline.chen@mc2.chalmers.se
Zonghe Lai
Swedish Microsystem Integration Technology (SMIT) Center & Electronics Production, Department of Microtechnology and Nanoscience,
Chalmers University of Technology
, Kemivagen 9, 412 96 Gothenburg, Sweden
Zhaonian Cheng
Swedish Microsystem Integration Technology (SMIT) Center & Electronics Production, Department of Microtechnology and Nanoscience,
Chalmers University of Technology
, Kemivagen 9, 412 96 Gothenburg, Sweden
Johan Liu
Swedish Microsystem Integration Technology (SMIT) Center & Electronics Production, Department of Microtechnology and Nanoscience,
Chalmers University of Technology
, Kemivagen 9, 412 96 Gothenburg, SwedenJ. Electron. Packag. Sep 2006, 128(3): 177-183 (7 pages)
Published Online: August 7, 2005
Article history
Received:
March 3, 2004
Revised:
August 7, 2005
Citation
Chen, L. C., Lai, Z., Cheng, Z., and Liu, J. (August 7, 2005). "Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection." ASME. J. Electron. Packag. September 2006; 128(3): 177–183. https://doi.org/10.1115/1.2227057
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