This paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages mounted in back-to-back and offset configurations. A cover plate is attached to the back side of the chips to enhance heat transfer from the module. The assembled organic carrier is placed in a vertical channel. A conjugate heat transfer model is used which accounts for conduction in the packages and the card and convection in the surrounding air. The effect of location of the modules on a card with zero, one and two power planes is evaluated for thermal performance. Heat dissipation is studied for forced convection (2, 1, and ). Comparison is made for single sided and back-to-back cases.
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December 2006
Research Papers
A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages
Sanjeev B. Sathe,
Sanjeev B. Sathe
Advanced Semiconductor Engineering
, Santa Clara, California 95054
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Bahgat G. Sammakia,
Bahgat G. Sammakia
Thomas J. Watson School of Engineering and Applied Science,
State University of New York at Binghamton
, Binghamton, New York 13902-6000
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K. Srihari
K. Srihari
Thomas J. Watson School of Engineering and Applied Science,
State University of New York at Binghamton
, Binghamton, New York 13902-6000
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Sandeep S. Tonapi
Sanjeev B. Sathe
Advanced Semiconductor Engineering
, Santa Clara, California 95054
Bahgat G. Sammakia
Thomas J. Watson School of Engineering and Applied Science,
State University of New York at Binghamton
, Binghamton, New York 13902-6000
K. Srihari
Thomas J. Watson School of Engineering and Applied Science,
State University of New York at Binghamton
, Binghamton, New York 13902-6000J. Electron. Packag. Dec 2006, 128(4): 305-310 (6 pages)
Published Online: February 10, 2006
Article history
Received:
July 28, 2003
Revised:
February 10, 2006
Citation
Tonapi, S. S., Sathe, S. B., Sammakia, B. G., and Srihari, K. (February 10, 2006). "A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages." ASME. J. Electron. Packag. December 2006; 128(4): 305–310. https://doi.org/10.1115/1.2351891
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