Time-dependent deformations such as creep and ratchetting of solder alloys are significant deformation phenomena that need to be understood to ensure the safety and reliability of solder joints in electronic packaging. There is much research on creep deformation of solder alloys, but ratchetting deformation, especially the correlation between creep and ratchetting deformation of solder alloys has not been investigated. This paper discusses the correlation between creep and uniaxial ratchetting deformation to establish the differences in the time-dependent deformation of lead-free and lead-containing solder alloys. Uniaxial ratchetting tests were conducted by cyclic tension–compression tests or cyclic tension–unloading tests at several ratios of the maximum to minimum stresses. Additional creep tests following the uniaxial ratchetting were also conducted to observe the effect of the uniaxial ratchetting on creep deformation. An empirical method to select an optimal lead-free solder alloy is discussed by defining a uniaxial ratchetting strain rate. The additional creep tests also show that the uniaxial ratchetting deformation has a strong correlation to the creep deformation and that the correlation is different for lead-free and lead-containing solder alloys.
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e-mail: katsu@eng.hokudai.ac.jp
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March 2007
Research Papers
Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of and Solder Alloys
Katsuhiko Sasaki,
Katsuhiko Sasaki
Associate Professor
Division of Human Mechanical Systems and Design,
e-mail: katsu@eng.hokudai.ac.jp
Hokkaido University
, N13, W8, Kita-ku, Sapporo 060-8628, Japan
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Takuji Kobayashi,
Takuji Kobayashi
Graduate Student
Division of Human Mechanical Systems and Design,
Hokkaido University
, N13, W8, Kita-ku, Sapporo 060-8628, Japan
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Ken-ichi Ohguchi
Ken-ichi Ohguchi
Associate Professor
Department of Material Science and Engineering,
Akita University
, Tegatagakuen-cho 1-1, Akita 010-8502, Japan
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Katsuhiko Sasaki
Associate Professor
Division of Human Mechanical Systems and Design,
Hokkaido University
, N13, W8, Kita-ku, Sapporo 060-8628, Japane-mail: katsu@eng.hokudai.ac.jp
Takuji Kobayashi
Graduate Student
Division of Human Mechanical Systems and Design,
Hokkaido University
, N13, W8, Kita-ku, Sapporo 060-8628, Japan
Ken-ichi Ohguchi
Associate Professor
Department of Material Science and Engineering,
Akita University
, Tegatagakuen-cho 1-1, Akita 010-8502, JapanJ. Electron. Packag. Mar 2007, 129(1): 82-89 (8 pages)
Published Online: May 21, 2006
Article history
Received:
December 6, 2005
Revised:
May 21, 2006
Citation
Sasaki, K., Kobayashi, T., and Ohguchi, K. (May 21, 2006). "Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of and Solder Alloys." ASME. J. Electron. Packag. March 2007; 129(1): 82–89. https://doi.org/10.1115/1.2429714
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