Abstract
The disturbed state concept (DSC) with the hierarchical single surface (HISS) plasticity model have been proposed and validated previously for a wide range of problems in electronic packaging. In this paper, detailed analyses are performed with the DSC∕HISS model to study the effect of various factors, such as computational and geometrical aspects and material parameters, on the failure life of chip substrate systems. The results and the methodology can be used for parametric analyses and optimal design of problems in electronic packaging.
Issue Section:
Technical Papers
References
1.
Desai
,
C. S.
, Chia
,
J.
,
Kundu
,
T.
, and
Prince
, J.
L.
, 1997,
“Thermomechanical Response of Materials and Interfaces in
Electronic Packaging; Part I—Unified Constitutive Model and
Calibration
,” ASME J. Electron. Packag.
1043-7398, 119
(4
), pp.
294
–300
; and Desai
,
C. S.
, Chia
,
J.
,
Kundu
,
T.
, and
Prince
, J.
L.
, 1997
“Thermomechanical Response of Materials and Interfaces in
Electronic Packaging; Part II—Unified Constitutive Model, Validation and
Design
,” ASME J. Electron. Packag.
1043-7398, 119
(4
), pp.
301
–309
2.
Basaran
,
C.
,
Desai
, C.
S.
, and Kundu
,
T.
,
1998, “Thermomechanical
Finite Element Analysis of Problems in Electronic Packaging Using the
Disturbed State Concept, Part I—Theory and Formulation
,”
ASME J. Electron. Packag.
1043-7398, 120
(1
), pp.
41
–49
; and Basaran
,
C.
,
Desai
, C.
S.
, and Kundu
,
T.
,
1998 “Thermomechanical
Finite Element Analysis of Problems in Electronic Packaging Using the
Disturbed State Concept, Part II—Verification and
Application
,” ASME J. Electron. Packag.
1043-7398, 120
(1
), pp.
48
–53
3.
Desai
, C.
S.
, Basaran
,
C.
,
Dishongh
,
T.
, and
Prince
,
J.
,
1998, “Thermomechanical
Analysis in Electronic Packaging with Unified Constitutive Model for
Materials and Joints
,” IEEE Trans. Compon., Packag.
Manuf. Technol., Part B
1070-9894,
21
(1
), pp.
87
–97
. 4.
Desai
, C.
S.
, and Whitenack
,
R.
,
2001, “Review of Models
and the Disturbed State Concept for Thermomechanical Analysis in Electronic
Packaging
,” ASME J. Electron. Packag.
1043-7398,
123
(1
), pp.
19
–23
. 5.
Desai
, C.
S.
, 2001,
Mechanics of Materials and Interfaces: The Disturbed State
Concept
, CRC
, Boca
Raton, FL
.6.
Whitenack
,
R.
, and
Desai
, C.
S.
, 2004,
“Design and Analysis of Solder Connections Using Accelerated
Approximate Procedure with Disturbed State Concept
,”
Report to National Science Foundation
, Department of Civil
Engineering and Engineering Mechanics, University of
Arizona
, Tucson,
AZ
.7.
Zwick
, J.
W.
, and Desai
, C.
S.
, 1999,
“Structural Reliability of PBGA Solder Joints with the
Disturbed State Concept
,” Proceedings of the
Interpack, 99
, ASME
,
HA
.8.
Desai
,
C. S.
, Wang
,
Z.
,
Whitenack
,
R.
, and
Kundu
,
T.
,
2004, “Testing and
Modeling of Solder Using New Test Device: Part I—Models and Testing, Part
II—Calibration and Validation
,” ASME J. Electron.
Packag.
1043-7398,
126
(2
), pp.
225
–231
; and Desai
,
C. S.
, Wang
,
Z.
,
Whitenack
,
R.
, and
Kundu
,
T.
,
2004 “Testing and
Modeling of Solder Using New Test Device: Part II—Calibration and
Validation
,” ASME J. Electron. Packag.
1043-7398,
126
(2
), pp.
232
–236
. 9.
Li
, H.
B.
, 2003,
“FEM Analysis with DSC Modeling for Materials in Chp-Sustrate
Systems
,” Ph.D. disesertation, University of Arizona,
Tucson, AZ.10.
“
COTS Reliability Validation and ASIC Solution for
Aerospace Defense Systems
,” Air Force Agreement No. F
33615-99-2-5501, Boeing Quarterly Technical Progress, Jun. 30,
2000.11.
Boeing, Seattle, Mostafa Rassaian,
2001, private
communication.
12.
Rassaian
,
M.
,
Lee
, J.
C.
, Twing
, D.
W.
, and Ramesh
, A.
V.
, 1998,
“Integrating PWA Design and Analysis Using a Unix-Based
Durability Tool Set
,” 17th Digital Avionics Systems
Conference (DASC)
, Bellevue
,
WA
.13.
Rassaian
,
M.
, and
Lee
, J.
C.
, 2004,
“Generalized Multi Domain Method for Fatigue Analysis of
Interconnect Structures
,” Finite Elem. Anal.
Design
0168-874X, 40
, pp.
793
–805
. 14.
Desai
, C.
S.
, 2000,
DSC-SST2D, Computer Code for Static, Dynamic, Creep and Thermal
Analysis: Solid, Structure and Soil-Structure Problems, Parts I to II, Tucson,
AZ.Copyright © 2007
by American Society of Mechanical Engineers
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