Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Increased use of sensors and controls in automotive applications has resulted in significant emphasis on the deployment of electronics directly mounted on the engine and transmission. Increased shock, vibration, and higher temperatures necessitate the fundamental understanding of damage mechanisms, which will be active in these environments. Electronics typical of office benign environments uses FR-4 printed circuit boards (PCBs). Automotive applications typically use high glass-transition temperature laminates such as FR4-06 glass∕epoxy laminate material $(Tg=164.9°C)$⁠. In application environments, metal backing of printed circuit boards is being targeted for thermal dissipation, mechanical stability, and interconnections reliability. In this study, the effect of metal-backed boards on the interconnect reliability has been evaluated. Previous studies on electronic reliability for automotive environments have addressed the damage mechanics of solder joints in plastic ball-grid arrays on non-metal-backed substrates (Lall et al., 2003, “Model for BGA and CSP in Automotive Underhood Environments,” Electronic Components and Technology Conference, New Orleans, LA, May 27–30, pp. 189–196;Syed, A. R., 1996, “Thermal Fatigue Reliability Enhancement of Plastic Ball Grid Array (PBGA) Packages,” Proceedings of the 1996 Electronic Components and Technology Conference, Orlando, FL, May 28–31, pp. 1211–1216;Evans et al., 1997, “PBGA Reliability for Under-the-Hood Automotive Applications,” Proceedings of InterPACK ’97, Kohala, HI, Jun. 15–19, pp. 215–219;Mawer et al., 1999, “Board-Level Characterization of 1.0 and 1.27mm Pitch PBGA for Automotive Under-Hood Applications,” Proceedings of the 1999 Electronic Components and Technology Conference, San Diego, CA, Jun. 1–4, pp. 118–124) and ceramic ball-grid arrays (BGAs) on non-metal-backed substrates (Darveaux, R., and Banerji, K., 1992, “Constitutive Relations for Tin-Based Solder Joints,” IEEE Trans-CPMT-A, Vol. 15, No. 6, pp. 1013–1024;Darveaux et al., 1995, “Reliability of Plastic Ball Grid Array Assembly,” Ball Grid Array Technology, Lau, J., ed., McGraw-Hill, New York, pp. 379–442;Darveaux, R., 2000, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation,” Proceedings of 50th ECTC, May, pp. 1048–1058). Delamination of PCBs from metal backing has also been investigated. The test vehicle is a metal-backed FR4-06 laminate. The printed circuit board has an aluminum metal backing, attached with pressure sensitive adhesive (PSA). Component architectures tested include plastic ball-grid array devices, C2BGA devices, QFN, and discrete resistors. Reliability of the component architectures has been evaluated for HASL. Crack propagation and intermetallic thickness data have been acquired as a function of cycle count. Reliability data have been acquired on all these architectures. Material constitutive behavior of PSA has been measured using uniaxial test samples. The measured constitutive behavior has been incorporated into nonlinear finite element simulations. Predictive models have been developed for the dominant failure mechanisms for all the component architectures tested.