A finite element method was developed to predict the effective thermal conductivity of particle filled epoxy composites. Three-dimensional models, which considered the effect of filler geometry, filler aspect ratio, conductivity ratio of filler to matrix, and interfacial layer were used to simulate the microstructure of epoxy composites for various filler volume fractions up to 30%. The calculated thermal conductivities were compared with results from existing theoretical models and experiments. Numerical estimation of ellipsoids-in-cube model accurately predicted thermal conductivity of epoxy composites with alumina filler particles. The number of length division during mesh process and particle numbers used in the finite element analysis affect the accuracy of calculated results. At a given value of filler content, the numerical results indicated a ratio of conductivity of filler to matrix for achieving the maximum thermal conductivity.
1.
Peng
, S.
, and Landel
, R.
, 1975, “Induced Anisotropy of Thermal Conductivity of Polymer Solids Under Large Strains
,” J. Appl. Polym. Sci.
0021-8995, 19
(1
), pp. 49
–68
.2.
Choy
, C. L.
, and Young
, K.
, 1977, “Thermal Conductivity of Semicrystalline Polymers—A Model
,” Polymer
0032-3861, 18
(8
), pp. 769
–776
.3.
Griesinger
, A.
, Hurler
, W.
, and Pietralla
, M.
, 1997, “A Photothermal Method With Step Heating for Measuring the Thermal Diffusivity of Anisotropic Solids
,” Int. J. Heat Mass Transfer
0017-9310, 40
(13
), pp. 3049
–3058
.4.
Bujard
, P.
, Kühnlein
, S.
, Ino
, S.
, and Shiobara
, T.
, 1994, “Thermal Conductivity of Molding Compounds for Plastic Packaging
,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A
1070-9886, 17
(4
), pp. 527
–532
.5.
Zhou
, W. Y.
, Qi
, S. H.
, Tu
, C. C.
, and Zhao
, H. Z.
, 2007, “Novel Heat-Conductive Composite Silicon Rubber
,” J. Appl. Polym. Sci.
0021-8995, 104
(4
), pp. 2478
–2483
.6.
Hsieh
, C. Y.
, and Chung
, S. L.
, 2006, “High Thermal Conductivity Epoxy Molding Compound Filled With a Combustion Synthesized AlN Powder
,” J. Appl. Polym. Sci.
0021-8995, 102
(5
), pp. 4734
–4740
.7.
Kumlutaş
, D.
, Tavman
, İ. H.
, and Çoban
, M. T.
, 2003, “Thermal Conductivity of Particle Filled Polyethylene Composite Materials
,” Compos. Sci. Technol.
0266-3538, 63
(1
), pp. 113
–117
.8.
Pezzotti
, G.
, Kamada
, I.
, and Miki
, S.
, 2000, “Thermal Conductivity of AlN/Polystyrene Interpenetrating Networks
,” J. Eur. Ceram. Soc.
0955-2219, 20
(8
), pp. 1197
–1203
.9.
Xie
, S. H.
, Zhu
, B. K.
, Li
, J. B.
, Wei
, X. Z.
, and Xu
, Z. K.
, 2004, “Preparation and Properties of Polyimide/Aluminum Nitride Composites
,” Polym. Test.
0142-9418, 23
(7
), pp. 797
–801
.10.
Richard
, F. H.
, and Peter
, H. S.
, 2002, “Thermal Conductivity of Platelet-Filled Polymer Composites
,” J. Am. Ceram. Soc.
0002-7820, 85
(4
), pp. 851
–857
.11.
Price
, D. M.
, and Jarratt
, M.
, 2002, “Thermal Conductivity of PTFE and PTFE Composites
,” Thermochim. Acta
0040-6031, 392–393
, pp. 231
–236
.12.
Li
, H. Y.
, Jacob
, K. I.
, and Wong
, C. P.
, 2003, “An Improvement of Thermal Conductivity of Underfill Materials for Flip-Chip Packages
,” IEEE Trans. Adv. Packag.
1521-3323, 26
(1
), pp. 25
–32
.13.
Procter
, P.
, and Solc
, J.
, 1991, “Improved Thermal Conductivity in Microelectronic Encapsulants
,” IEEE Trans. Compon., Hybrids, Manuf. Technol.
0148-6411, 14
(4
), pp. 708
–713
.14.
Lee
, G. W.
, Park
, M.
, Kim
, J. K.
, Lee
, J. I.
, and Yoon
, H. G.
, 2006, “Enhanced Thermal Conductivity of Polymer Composites Filled With Hybrid Filler
,” Composites, Part A
1359-835X, 37
(5
), pp. 727
–734
.15.
Bujard
, P.
, 1988, “Thermal Conductivity of Boron Nitride Filled Epoxy Resin: Temperature Dependence and Influence of Sample Preparation
,” Proceedings of the Thermal Phenomena in the Fabrication and Operation of Electronic Components: I-Therm ‘88, InterSociety Conference
, pp. 41
–49
.16.
Bae
, J. W.
, Kim
, W. H.
, and Cho
, S. H.
, 2000, “The Properties of AlN-Filled Epoxy Molding Compounds by the Effects of Filler Size Distribution
,” J. Mater. Sci.
0022-2461, 35
(23
), pp. 5907
–5913
.17.
He
, H.
, Fu
, R. L.
, Shen
, Y.
, Han
, Y. C.
, and Song
, X. F.
, 2007, “Preparation and Properties of Si3N4/PS Composites Used for Electronic Packaging
,” Compos. Sci. Technol.
0266-3538, 67
(11–12
), pp. 2493
–2499
.18.
Lee
, W. S.
, and Yu
, J.
, 2005, “Comparative Study of Thermally Conductive Fillers in Underfill for the Electronic Components
,” Diamond Relat. Mater.
0925-9635, 14
(10
), pp. 1647
–1653
.19.
Chen
, Y. M.
, and Ting
, J. M.
, 2002, “Ultra High Thermal Conductivity Polymer Composites
,” Carbon
0008-6223, 40
(3
), pp. 359
–362
.20.
Fu
, S. Y.
, and Mai
, Y. W.
, 2003, “Thermal Conductivity of Misaligned Short-Fiber-Reinforced Polymer Composites
,” J. Appl. Polym. Sci.
0021-8995, 88
(6
), pp. 1497
–1505
.21.
Maxwell
, J. C.
, 1954, A Treatise on Electricity and Magnetism
, 3rd ed., Dover
, New York
.22.
Tsao
, G. T. N.
, 1961, “Thermal Conductivity of Two Phase Materials
,” Ind. Eng. Chem.
0019-7866, 53
(5
), pp. 395
–397
.23.
Cheng
, S. C.
, and Vachon
, R. I.
, 1969, “The Prediction of the Thermal Conductivity of Two and Three Phase Solid Heterogeneous Mixtures
,” Int. J. Heat Mass Transfer
0017-9310, 12
(3
), pp. 249
–264
.24.
Scarisbrick
, R. M.
, 1973, “Electrically Conductivity Mixtures
,” J. Phys. D
0022-3727, 6
(17
), pp. 2098
–2110
.25.
Lewis
, T.
, and Nielsen
, L.
, 1970, “Dynamic Mechanical Properties of Particulate-Filled Polymers
,” J. Appl. Polym. Sci.
0021-8995, 14
(6
), pp. 1449
–1471
.26.
Padilla
, A.
, Sanchez-Solis
, A.
, and Manero
, O.
, 1988, “A Note on Thermal Conductivity of Filled Polymers
,” J. Compos Mater.
, 22
(7
), pp. 616
–628
.27.
Russell
, H. W.
, 1935, “Principles of Heat Flow in Porous Insulation
,” J. Am. Ceram. Soc.
0002-7820, 18
(1–12
), pp. 1
–5
.28.
Agari
, Y.
, and Uno
, T.
, 1985, “Thermal Conductivity of Polymer Filled With Carbon Materials: Effect of Conductive Particle Chains on Thermal Conductivity
,” J. Appl. Polym. Sci.
0021-8995, 30
(5
), pp. 2225
–2235
.29.
Agari
, Y.
, Ueda
, A.
, and Nagai
, S.
, 1991, “Thermal Conductivity of Polyethylene Filled With Disoriented Short-Cut Carbon Fibers
,” J. Appl. Polym. Sci.
0021-8995, 43
(6
), pp. 1117
–1124
.30.
Agari
, Y.
, Ueda
, A.
, and Nagai
, S.
, 1993, “Thermal Conductivity of a Polymer Composite
,” J. Appl. Polym. Sci.
0021-8995, 49
(9
), pp. 1625
–1634
.31.
Ramani
, K.
, and Vaidyanathan
, A.
, 1995, “Finite Element Analysis of Effective Thermal Conductivity of Filled Polymeric Composites
,” J. Compos. Mater.
0021-9983, 29
(13
), pp. 1725
–1740
.32.
Kumlutas
, D.
, and Tavman
, I. H.
, 2006, “A Numerical and Experimental Study on Thermal Conductivity of Particle Filled Polymer Composites
,” J. Thermoplast Compos. Mater.
, 19
(4
), pp. 441
–455
.33.
Yin
, Y.
, and Tu
, S. T.
, 2002, “Thermal Conductivity of PTFE Composites With Random Distributed Graphite Particles
,” J. Reinf. Plast. Comp.
, 21
(18
), pp. 1619
–1627
.34.
Tu
, S. T.
, Cai
, W. Z.
, Yin
, Y.
, and Ling
, X.
, 2005, “Numerical Simulation of Saturation Behavior of Physical Properties in Composites With Randomly Distributed Second-phase
,” J. Compos. Mater.
0021-9983, 39
(7
), pp. 617
–631
.35.
Cai
, W. Z.
, Tu
, S. T.
, and Tao
, G. L.
, 2005, “Thermal Conductivity of PTFE Composites With Three-Dimensional Randomly Distributed Fillers
,” J. Thermoplast. Compos. Mater.
, 18
(3
), pp. 241
–253
.36.
Munro
, R. G.
, 1997, “Evaluated Material Properties for a Sintered α-Alumina
,” J. Am. Ceram. Soc.
0002-7820, 80
(8
), pp. 1919
–1928
.37.
Sridhar
, L.
, and Narh
, K. A.
, 2000, “Finite Size Gap Effects on the Modeling of Thermal Contact Conductance at Polymer-Mold Wall Interface in Injection Molding
,” J. Appl. Polym. Sci.
0021-8995, 75
(14
), pp. 1776
–1782
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