A fundamental study is carried out to investigate the microstructure and surface treatment possibilities of 304 stainless steel (304SS) substrates. To expose the microstructure, mirror-finished 304SS is applied with a self-mixed etchant containing ammonium sulfite ((NH4)2SO3), iron chloride (FeCl3), hydrochloric acid (HCl), and nitric acid (HNO3). Scanning electron microscope (SEM) images exhibit quite clear rocky-wall-like structure. Grain boundaries are clearly observed. Each grain contains many subgrains and the average grain size is 10 μm. Energy dispersive X-ray analysis determines the composition as 69 wt. % iron (Fe), 19 wt. % chromium (Cr), 10 wt. % nickel (Ni), around 2 wt. % manganese (Mn), and less than 0.08 wt. % carbon (C), which agrees well with the data provided by the manufacturer. Diffraction peaks produced by X-ray diffraction (XRD) are able to correspond to profiles found in XRD database, showing that 304SS has face-centered cubic crystal lattice. The Ni strike technique is used as surface treatment to make 304SS bondable to other metals, such as silver (Ag), copper (Cu), and gold (Au), commonly used in electronic packaging. Cross section SEM images show that thick Ag, Cu, up to 50 μm, and Au, up to 70 μm, were successfully plated over the thin Ni layer that was plated on 304SS.
Skip Nav Destination
e-mail: chusha.uci@gmail.com
Article navigation
June 2011
Research Papers
Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
Chu-Hsuan Sha,
Chu-Hsuan Sha
Electrical Engineering and Computer Science Materials and Manufacturing Technology,
e-mail: chusha.uci@gmail.com
University of California
, Irvine, Irvine, CA 92697-2660
Search for other works by this author on:
Chin C. Lee
Chin C. Lee
Electrical Engineering and Computer Science Materials and Manufacturing Technology,
University of California
, Irvine, Irvine, CA 92697-2660
Search for other works by this author on:
Chu-Hsuan Sha
Electrical Engineering and Computer Science Materials and Manufacturing Technology,
University of California
, Irvine, Irvine, CA 92697-2660e-mail: chusha.uci@gmail.com
Chin C. Lee
Electrical Engineering and Computer Science Materials and Manufacturing Technology,
University of California
, Irvine, Irvine, CA 92697-2660J. Electron. Packag. Jun 2011, 133(2): 021005 (4 pages)
Published Online: June 23, 2011
Article history
Received:
June 9, 2010
Revised:
April 5, 2011
Online:
June 23, 2011
Published:
June 23, 2011
Citation
Sha, C., and Lee, C. C. (June 23, 2011). "Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging." ASME. J. Electron. Packag. June 2011; 133(2): 021005. https://doi.org/10.1115/1.4003990
Download citation file:
Get Email Alerts
Cited By
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Related Articles
Distributions of Stretch and Rotation in Polycrystalline OFHC Cu
J. Eng. Mater. Technol (July,2002)
Editorial
J. Eng. Mater. Technol (January,2002)
Microstructure Development During High Strain Torsion of NiAl
J. Eng. Mater. Technol (January,2009)
Effect of Meso to Micro Transition in Morphology Dependent Fracture of SiC Ceramics
J. Eng. Mater. Technol (October,2011)
Related Proceedings Papers
Related Chapters
Surface Analysis and Tools
Tribology of Mechanical Systems: A Guide to Present and Future Technologies
Grain Size and Grain-Boundaries Consequences on Diffusion and Trapping of Hydrogen in Pure Nickel
International Hydrogen Conference (IHC 2012): Hydrogen-Materials Interactions
Accommodation and Stability of Alloying Elements in Amorphous Grain Boundaries of Zirconia
Zirconium in the Nuclear Industry: 20th International Symposium