Reactive joining, i.e., utilization of an exothermal reaction to locally generate the heat required for soldering or brazing, represents an emerging technology for flexible and benign joining of heat-sensitive materials, e.g., for microelectromechanical systems (MEMS) applications. However, for successful reactive joining, precise control of heat production and heat distribution is mandatory in order to avoid damaging of the components during the process. For the exemplary case of borosilicate glass, the reactive joining process for a both thermally and mechanically sensitive material is developed. Employing various nondestructive and destructive testing methods, typical problems which can occur upon reactive joining are identified, e.g., exposure of the joining zone to excessive temperatures, experience of thermal shock by the substrate due to sudden temperature increase, and generation of residual stresses in substrate and soldering zone. Utilizing the results of nondestructive and destructive testing, procedures for successful reactive joining of borosilicate glass, silicon and aluminum oxide are provided.
Skip Nav Destination
Article navigation
December 2018
Research-Article
Reactive Joining of Thermally and Mechanically Sensitive Materials
Bastian Rheingans,
Bastian Rheingans
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: bastian.rheingans@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: bastian.rheingans@empa.ch
Search for other works by this author on:
Roman Furrer,
Roman Furrer
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: roman.furrer@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: roman.furrer@empa.ch
Search for other works by this author on:
Jürg Neuenschwander,
Jürg Neuenschwander
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: juerg.neuenschwander@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: juerg.neuenschwander@empa.ch
Search for other works by this author on:
Irina Spies,
Irina Spies
Hahn-Schickard,
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: irina.spies@hahn-schickard.de
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: irina.spies@hahn-schickard.de
Search for other works by this author on:
Axel Schumacher,
Axel Schumacher
Hahn-Schickard, Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: axel.schumacher@hahn-schickard.de
Villingen-Schwenningen 78052, Germany
e-mail: axel.schumacher@hahn-schickard.de
Search for other works by this author on:
Stephan Knappmann,
Stephan Knappmann
Hahn-Schickard,
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: stephan.knappmann@hahn-schickard.de
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: stephan.knappmann@hahn-schickard.de
Search for other works by this author on:
Lars P. H. Jeurgens,
Lars P. H. Jeurgens
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: lars.jeurgens@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: lars.jeurgens@empa.ch
Search for other works by this author on:
Jolanta Janczak-Rusch
Jolanta Janczak-Rusch
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: jolanta.janczak@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: jolanta.janczak@empa.ch
Search for other works by this author on:
Bastian Rheingans
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: bastian.rheingans@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: bastian.rheingans@empa.ch
Roman Furrer
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: roman.furrer@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: roman.furrer@empa.ch
Jürg Neuenschwander
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: juerg.neuenschwander@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: juerg.neuenschwander@empa.ch
Irina Spies
Hahn-Schickard,
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: irina.spies@hahn-schickard.de
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: irina.spies@hahn-schickard.de
Axel Schumacher
Hahn-Schickard, Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: axel.schumacher@hahn-schickard.de
Villingen-Schwenningen 78052, Germany
e-mail: axel.schumacher@hahn-schickard.de
Stephan Knappmann
Hahn-Schickard,
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: stephan.knappmann@hahn-schickard.de
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: stephan.knappmann@hahn-schickard.de
Lars P. H. Jeurgens
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: lars.jeurgens@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: lars.jeurgens@empa.ch
Jolanta Janczak-Rusch
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: jolanta.janczak@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: jolanta.janczak@empa.ch
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received February 28, 2018; final manuscript received July 20, 2018; published online September 10, 2018. Assoc. Editor: Xiaobing Luo.
J. Electron. Packag. Dec 2018, 140(4): 041006 (8 pages)
Published Online: September 10, 2018
Article history
Received:
February 28, 2018
Revised:
July 20, 2018
Citation
Rheingans, B., Furrer, R., Neuenschwander, J., Spies, I., Schumacher, A., Knappmann, S., Jeurgens, L. P. H., and Janczak-Rusch, J. (September 10, 2018). "Reactive Joining of Thermally and Mechanically Sensitive Materials." ASME. J. Electron. Packag. December 2018; 140(4): 041006. https://doi.org/10.1115/1.4040978
Download citation file:
Get Email Alerts
Cited By
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Related Articles
Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies
J. Electron. Packag (September,2018)
Investigation of Flip-Chip Bonding for MEMS Applications
J. Electron. Packag (March,2004)
Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB
J. Electron. Packag (March,2008)
Design for Reliability Applied to Packaging of a MOEMS Switch
J. Electron. Packag (December,2008)
Related Proceedings Papers
Related Chapters
Surface Analysis and Tools
Tribology of Mechanical Systems: A Guide to Present and Future Technologies
Development of New Measurement Method Applying MEMS Technology for Relative Slip Range During Fretting Fatigue Test in Hydrogen
International Hydrogen Conference (IHC 2016): Materials Performance in Hydrogen Environments
KPCA-Kalman Filtering for the MEMS-SINS/GPS Integrated Navigation System
International Symposium on Information Engineering and Electronic Commerce, 3rd (IEEC 2011)