Topics: Equilibrium (Physics) , Finite element methods , Shapes , Solder joints , Finite element analysis , Potential energy , Interpolation , Stress , Surface mount packaging , Theorems (Mathematics)

Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints

Y.-H. Pao, S. Badgley, E. Jih, R. Govila, J. Browning

J. Electron. Packag. June 1993, 115(2): 147–152. doi: https://doi.org/10.1115/1.2909310

Abstract

View articletitled, Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints

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Topics: Cycles , Fatigue , Solder joints , Creep , Deformation , Solders , Steady state , Cooling , Failure , Failure mechanisms

Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening

P. Hacke, A. F. Sprecher, H. Conrad

J. Electron. Packag. June 1993, 115(2): 153–158. doi: https://doi.org/10.1115/1.2909311

Abstract

View articletitled, Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening

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Topics: Computer simulation , Fatigue , Solder joints , Thermomechanics , Creep , Stress , Cycles , Damage , Failure , Fatigue life

Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints

Z. Guo, H. Conrad

J. Electron. Packag. June 1993, 115(2): 159–164. doi: https://doi.org/10.1115/1.2909312

Abstract

View articletitled, Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints

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Topics: Fatigue cracks , Solder joints , Shear (Mechanics) , Solders , Intermetallic compounds , Metals , Preferences , Temperature

Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters

R. G. Ross, Jr., L. C. Wen, G. R. Mon

J. Electron. Packag. June 1993, 115(2): 165–172. doi: https://doi.org/10.1115/1.2909313

Abstract

View articletitled, Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters

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Topics: Construction , Creep , Relaxation (Physics) , Solder joints , Stress , Solders , Stiffness , Complex systems , Cycles , Damage

The Influence of the Cycle Frequency and Wave Shape on the Fatigue Life of Leaded Chip Carrier Printed Wiring Board Interconnections

H. D. Solomon

J. Electron. Packag. June 1993, 115(2): 173–179. doi: https://doi.org/10.1115/1.2909314

Abstract

View articletitled, The Influence of the Cycle Frequency and Wave Shape on the Fatigue Life of Leaded Chip Carrier Printed Wiring Board Interconnections

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Topics: Cycles , Fatigue life , Printed circuit boards , Shapes , Waves , Displacement , Fatigue , Solder joints

Solder Joint Reliability of Surface Mount Connectors

J. Lau, T. Marcotte, J. Severine, A. Lee, S. Erasmus, T. Baker, J. Moldaschel, M. Sporer, G. Burward-Hoy

J. Electron. Packag. June 1993, 115(2): 180–188. doi: https://doi.org/10.1115/1.2909315

Abstract

View articletitled, Solder Joint Reliability of Surface Mount Connectors

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Topics: Reliability , Solder joints , Surface mount packaging , Experimental methods

Modeling the Vibration Restraints of Wedge Lock Card Guides

D. B. Barker, Y. S. Chen

J. Electron. Packag. June 1993, 115(2): 189–194. doi: https://doi.org/10.1115/1.2909316

Abstract

View articletitled, Modeling the Vibration Restraints of Wedge Lock Card Guides

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Topics: Locks (Waterways) , Modeling , Vibration , Wedges , Boundary-value problems , Deflection , Elastic constants , Frequency response , Rotation , Springs

Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components

D. B. Barker, Y. S. Chen, A. Dasgupta

J. Electron. Packag. June 1993, 115(2): 195–200. doi: https://doi.org/10.1115/1.2909317

Abstract

View articletitled, Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components

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Topics: Fatigue life , Surface mount components , Vibration , Finite element analysis , Modeling , Printed circuit boards , Reliability , Solder joints , Stress analysis (Engineering)

Advances in Bonding Technology for Electronic Packaging

Chin C. Lee, Chen Y. Wang, Goran Matijasevic

J. Electron. Packag. June 1993, 115(2): 201–207. doi: https://doi.org/10.1115/1.2909318

Abstract

View articletitled, Advances in Bonding Technology for Electronic Packaging

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Topics: Bonding , Electronic packaging , Alloys , Temperature , Acoustics , Diffusion (Physics) , Melting point , Microscopy , Oxidation , Soldering

The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam

Wan-Lee Yin

J. Electron. Packag. June 1993, 115(2): 208–213. doi: https://doi.org/10.1115/1.2909319

Abstract

View articletitled, The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam

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Topics: Thermal stresses , Stress , Elasticity , Polynomials , Stress singularity , Variational techniques , Wedges

Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions

Frank F. H. Wu

J. Electron. Packag. June 1993, 115(2): 214–218. doi: https://doi.org/10.1115/1.2909320

Abstract

View articletitled, Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions

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Topics: Polynomials , Stress , Temperature distribution , Heating , Failure , Fracture (Process) , Manufacturing , Temperature , Thermal expansion , Thermal stresses

Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design

R. K. Agarwal, A. Dasgupta

J. Electron. Packag. June 1993, 115(2): 219–224. doi: https://doi.org/10.1115/1.2909321

Abstract

View articletitled, Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design

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Topics: Composite materials , Design , Electrical properties , Printed circuit boards , Textiles , Boundary-value problems , Epoxy adhesives , Epoxy resins , Finite element methods , Glass

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Foreword

Special Issue on Mechanics of Surface Mount Assemblies

Research Papers

Finite Element Method for Predicting Equilibrium Shapes of Solder Joints

Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints

Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening

Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints

Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters

The Influence of the Cycle Frequency and Wave Shape on the Fatigue Life of Leaded Chip Carrier Printed Wiring Board Interconnections

Solder Joint Reliability of Surface Mount Connectors

Modeling the Vibration Restraints of Wedge Lock Card Guides

Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components

Advances in Bonding Technology for Electronic Packaging

The Effects of Inclined Free Edges on the Thermal Stresses in a Layered Beam

Analytical Solutions of Stresses in a Cylindrical Plate Due to Polynomial Radial Temperature Distributions

Prediction of Electrical Properties of Plain-Weave Fabric Composites for Printed Wiring Board Design

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