Volume 115 Issue 3 | J. Electron. Packag.

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Volume 115, Issue 3

September 1993

ISSN 1043-7398

EISSN 1528-9044

Research Papers

Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages

L. T. Nguyen, M. Michael

J. Electron. Packag. September 1993, 115(3): 225–232. doi: https://doi.org/10.1115/1.2909322

Abstract

View articletitled, Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages

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Topics: Adhesion , Acoustics , Cracking (Materials) , Deformation , Delamination , Design , Epoxy adhesives , Epoxy resins , Fatigue failure , Finite element analysis

Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests

J. A. Owczarek

J. Electron. Packag. September 1993, 115(3): 233–239. doi: https://doi.org/10.1115/1.2909323

Abstract

View articletitled, Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests

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Topics: Coating processes , Coatings , Electronic components , Yield stress , Circuits , Die cutting , Flow (Dynamics) , Shear stress , Shearing (Deformation)

Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter

J. A. Owczarek

J. Electron. Packag. September 1993, 115(3): 240–248. doi: https://doi.org/10.1115/1.2909324

Abstract

View articletitled, Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter

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Topics: Coating processes , Coatings , Electronic components , Skin , Yield stress , Die cutting , Disperse systems , Electronic circuits , Flow (Dynamics) , Shear stress

Debonding in Overmolded Integrated Circuit Packages

S. Hunt, L. A. Carlsson

J. Electron. Packag. September 1993, 115(3): 249–255. doi: https://doi.org/10.1115/1.2909325

Abstract

View articletitled, Debonding in Overmolded Integrated Circuit Packages

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Topics: Analytical methods , Bond strength , Electronic packages , Failure , Finite element analysis , Integrated circuits , Printed circuit boards , Shear (Mechanics) , Stress , Stress analysis (Engineering)

Factors Affecting the Adhesion of Fluoropolymer Composites to Commercial Copper Foils

L. J. Jimarez, L. J. Matienzo, A. A. Mehta

J. Electron. Packag. September 1993, 115(3): 256–263. doi: https://doi.org/10.1115/1.2909326

Abstract

View articletitled, Factors Affecting the Adhesion of Fluoropolymer Composites to Commercial Copper Foils

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Topics: Adhesion , Composite materials , Copper foil , Fillers (Materials) , Glass , Manufacturing , Lamination , Metals , Microelectronic packaging , Polymers

Time-Dependent Fracture of Polyimide Films

S. F. Popelar, C. H. Popelar, V. H. Kenner

J. Electron. Packag. September 1993, 115(3): 264–269. doi: https://doi.org/10.1115/1.2909327

Abstract

View articletitled, Time-Dependent Fracture of Polyimide Films

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Topics: Fracture (Materials) , Stress , Fracture mechanics , Temperature

Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling

Shigekazu Kieda, Noriyuki Ashiwake, Takahiro Daikoku, Shizuo Zushi

J. Electron. Packag. September 1993, 115(3): 270–275. doi: https://doi.org/10.1115/1.2909328

Abstract

View articletitled, Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling

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Topics: Computer cooling , Finite element methods , Thermal analysis , Computers , Cooling , Heat , Sensitivity analysis , Temperature , Temperature distribution , Thermal properties

Thermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source

Ling Yan, A. Haji-Sheikh, J. V. Beck

J. Electron. Packag. September 1993, 115(3): 276–283. doi: https://doi.org/10.1115/1.2909329

Abstract

View articletitled, Thermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source

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Topics: Heat , Thin films , Temperature , Boundary-value problems , Computation , Diamond films , Heat conduction , Temperature distribution

An Integral Heat Sink for Cooling Microelectronic Components

S. H. Bhavnani, C.-P. Tsai, R. C. Jaeger, D. L. Eison

J. Electron. Packag. September 1993, 115(3): 284–291. doi: https://doi.org/10.1115/1.2909330

Abstract

View articletitled, An Integral Heat Sink for Cooling Microelectronic Components

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Topics: Cooling , Heat sinks , Boiling , Heat , Silicon , Cavities , Atmospheric pressure , Etching , Flux (Metallurgy) , Heat transfer

Numerical Study of Flow and Heat Transfer for Circular Jet Impingement on the Bottom of a Cylindrical Cavity

S. Gavali, K. Karki, S. Patankar, K. Miura

J. Electron. Packag. September 1993, 115(3): 292–297. doi: https://doi.org/10.1115/1.2909331

Abstract

View articletitled, Numerical Study of Flow and Heat Transfer for Circular Jet Impingement on the Bottom of a Cylindrical Cavity

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Topics: Cavities , Flow (Dynamics) , Heat transfer , Nozzles , Separation (Technology) , Disks , Fluids , Reynolds number , Thermal boundary layers

An Experimental/Analytical Study of Strains in Encapsulated Assemblies

T. R. Guess, S. N. Burchett

J. Electron. Packag. September 1993, 115(3): 298–304. doi: https://doi.org/10.1115/1.2909332

Abstract

View articletitled, An Experimental/Analytical Study of Strains in Encapsulated Assemblies

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Topics: Casting , Epoxy adhesives , Epoxy resins , Finite element analysis , Hardening (Curing) , Metals , Strain gages , Stress , Temperature , Thermocouples

Thermal Fatigue of Low-Temperature Solder Alloys in Insertion Mount Assembly

J. Seyyedi

J. Electron. Packag. September 1993, 115(3): 305–311. doi: https://doi.org/10.1115/1.2909333

Abstract

View articletitled, Thermal Fatigue of Low-Temperature Solder Alloys in Insertion Mount Assembly

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Topics: Alloys , Fatigue , Low temperature , Manufacturing , Solders , Bearings , Failure mechanisms , Fatigue testing , Solder joints

Component Rearrangement on Printed Wiring Boards to Maximize the Fundamental Natural Frequency

Tien-Sheng Chang, E. B. Magrab

J. Electron. Packag. September 1993, 115(3): 312–321. doi: https://doi.org/10.1115/1.2909334

Abstract

View articletitled, Component Rearrangement on Printed Wiring Boards to Maximize the Fundamental Natural Frequency

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Topics: Printed circuit boards , Algorithms , Boundary-value problems , Simulated annealing , Design , Materials properties

Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions

John Lau, Steve Erasmus

J. Electron. Packag. September 1993, 115(3): 322–328. doi: https://doi.org/10.1115/1.2909335

Abstract

View articletitled, Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions

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Topics: Reliability , Solder joints , Corners (Structural elements) , Fatigue , Fatigue life , Finite element methods , Solders , Stress , Thermal stresses

Finding the Constitutive Relation for a Specific Elastomer

Yun Ling, Peter A. Engel, Wm. L. Brodskey, Yifan Guo

J. Electron. Packag. September 1993, 115(3): 329–336. doi: https://doi.org/10.1115/1.2909336

Abstract

View articletitled, Finding the Constitutive Relation for a Specific Elastomer

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Topics: Elastomers , Compression , Deflection , Deformation , Finite element analysis , Natural rubber , Polynomials , Shear (Mechanics) , Springs , Stress

Technical Briefs

Closed-Form Solutions for the Large Deflections of Curved Optical Glass Fibers Under Combined Loads

J. H. Lau

J. Electron. Packag. September 1993, 115(3): 337–339. doi: https://doi.org/10.1115/1.2909337

View articletitled, Closed-Form Solutions for the Large Deflections of Curved Optical Glass Fibers Under Combined Loads

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Topics: Deflection , Fibers , Optical glass , Stress

A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards

A. Hadim

J. Electron. Packag. September 1993, 115(3): 339–342. doi: https://doi.org/10.1115/1.2909338

Abstract

View articletitled, A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards

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Topics: Design methodology , Printed circuit boards , Thermal analysis , Algorithms , Computer-aided engineering , Design , Errors , Modeling , Natural convection , Temperature

Book Reviews

Thermal Stress and Strain in Microelectronics Packaging

John H. Lau, Editor, Peter A. Engel, Reviewer

J. Electron. Packag. September 1993, 115(3): 343. doi: https://doi.org/10.1115/1.2909339

View articletitled, <em>Thermal Stress and Strain in Microelectronics Packaging</em>

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Topics: Microelectronic packaging , Thermal stresses

Structural Analysis of Printed Circuit Board Systems

Peter A. Engel, Author, J. H. Lau, Reviewer

J. Electron. Packag. September 1993, 115(3): 343–344. doi: https://doi.org/10.1115/1.2909340

View articletitled, <em>Structural Analysis of Printed Circuit Board Systems</em>

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Topics: Printed circuit boards , Structural analysis

Research Papers

Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages

Coating of Electronic Components by the RTV Dispersion—Part I: Physical Model of the Deposition Process Determined by Drop Tests

Coating of Electronic Components by the RTV Dispersion—Part II: Determination of the Residual Yield Stress After Deposition, and Method to Produce a Drop of Required Cured Skin Thickness and Diameter

Debonding in Overmolded Integrated Circuit Packages

Factors Affecting the Adhesion of Fluoropolymer Composites to Commercial Copper Foils

Time-Dependent Fracture of Polyimide Films

Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling

Thermal Characteristics of Two-Layered Bodies With Embedded Thin-Film Heat Source

An Integral Heat Sink for Cooling Microelectronic Components

Numerical Study of Flow and Heat Transfer for Circular Jet Impingement on the Bottom of a Cylindrical Cavity

An Experimental/Analytical Study of Strains in Encapsulated Assemblies

Thermal Fatigue of Low-Temperature Solder Alloys in Insertion Mount Assembly

Component Rearrangement on Printed Wiring Boards to Maximize the Fundamental Natural Frequency

Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions

Finding the Constitutive Relation for a Specific Elastomer

Technical Briefs

Closed-Form Solutions for the Large Deflections of Curved Optical Glass Fibers Under Combined Loads

A Simplified Thermal Analysis and Design Methodology for Printed Circuit Boards

Book Reviews

Thermal Stress and Strain in Microelectronics Packaging

Structural Analysis of Printed Circuit Board Systems

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