Topics: Semiconductors (Materials) , Wire , Deformation , Flow (Dynamics) , Bubbles , Cavities , Fluids , Model development , Shapes , Transfer molding

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

B. Han, Y. Guo

J. Electron. Packag. September 1995, 117(3): 185–191. doi: https://doi.org/10.1115/1.2792090

Abstract

View articletitled, Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

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Topics: Electronic packaging , Interferometry , Thermal deformation , Deformation , Packaging , Design , Displacement measurement , Mechanical behavior , Optimization , Product development

Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging

Arvind Krishna, B. D. Harper, J. K. Lee

J. Electron. Packag. September 1995, 117(3): 192–200. doi: https://doi.org/10.1115/1.2792091

Abstract

View articletitled, Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging

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Topics: Electronic packaging , Finite element analysis , Temperature , Stress , Creep , Cycles , Diffusion (Physics) , Elastic analysis , Failure mechanisms , Finite element methods

A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate

Y. F. Luo, K. P. Rajurkar

J. Electron. Packag. September 1995, 117(3): 201–207. doi: https://doi.org/10.1115/1.2792092

Abstract

View articletitled, A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate

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Topics: Bonding , Micromechanics (Engineering) , Strips , Separation (Technology) , Adhesion , Brittleness , Deformation , Hardening , Heat treating (Metalworking) , Manufacturing

Investigation of a Heat Pipe Array for Convective Cooling

A. H. Howard, G. P. Peterson

J. Electron. Packag. September 1995, 117(3): 208–214. doi: https://doi.org/10.1115/1.2792093

Abstract

View articletitled, Investigation of a Heat Pipe Array for Convective Cooling

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Topics: Cooling , Heat pipes , Heat , Copper , Electrical measurement , Fins , Flow (Dynamics) , Pressure drop , Thermal resistance , Water

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

K. J. Zwick, I. M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. September 1995, 117(3): 215–219. doi: https://doi.org/10.1115/1.2792094

Abstract

View articletitled, Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

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Topics: Flow visualization , Hardening (Curing) , Jets , Ovens , Vapors , Vortices , Condensation , Contamination , Flow (Dynamics) , Bonding

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen

J. Electron. Packag. September 1995, 117(3): 220–224. doi: https://doi.org/10.1115/1.2792095

Abstract

View articletitled, Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

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Topics: Computer simulation , Hardening (Curing) , Jets , Ovens , Pressure , Vapors , Design , Contamination , Flow visualization , Heat

Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages

Mary J. Li, Michael Pecht

J. Electron. Packag. September 1995, 117(3): 225–229. doi: https://doi.org/10.1115/1.2792096

Abstract

View articletitled, Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages

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Topics: Electronic packages , Electrons , Failure mechanisms , Bonding , Failure , Fibers , Microcracks , Printed circuit boards , Resins , Scanning electron microscopy

Study of Print Release Process in Solder Paste Printing

C. Sahay, L. M. Head, R. Shereen, P. Dujari, J. H. Constable, G. Westby

J. Electron. Packag. September 1995, 117(3): 230–234. doi: https://doi.org/10.1115/1.2792097

Abstract

View articletitled, Study of Print Release Process in Solder Paste Printing

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Topics: Printing , Solders , Shear strength , Boundary layers , Density , Dimensions , Reflow soldering , Separation (Technology) , Shear (Mechanics) , Surface mount technology

Application of Statistical Clustering to Screen Printing Process Control

V. A. Skormin, C. R. Herman, L. J. Popyack

J. Electron. Packag. September 1995, 117(3): 235–240. doi: https://doi.org/10.1115/1.2792098

Abstract

View articletitled, Application of Statistical Clustering to Screen Printing Process Control

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Topics: Performance , Printing , Process control , Surface mount assemblies

Wetting Kinetics of Molten 60Sn40Pb on a Ag-0.33 wt.% Pt Thick Film Conductor

J. Campbell, H. Conrad

J. Electron. Packag. September 1995, 117(3): 241–245. doi: https://doi.org/10.1115/1.2792099

Abstract

View articletitled, Wetting Kinetics of Molten 60Sn40Pb on a Ag-0.33 wt.% Pt Thick Film Conductor

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Topics: Thick films , Wetting , Temperature , Tin , Alloys , Atoms , Diffusion (Physics) , Intermetallic compounds , Solders

Technical Briefs

Numerical Studies of Non-Newtonian Channel Flow and Heat Transfer Enhancement for Electronics Modules

F. C. Chou, F. K. Tsou, C. W. Tung

J. Electron. Packag. September 1995, 117(3): 246–249. doi: https://doi.org/10.1115/1.2792100

View articletitled, Numerical Studies of Non-Newtonian Channel Flow and Heat Transfer Enhancement for Electronics Modules

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Topics: Channel flow , Electronics , Heat transfer

A Rubbery Cure Shrinkage Model for Analyzing Encapsulated Assemblies

R. S. Chambers, R. R. Lagasse, T. R. Guess, D. J. Plazek, C. Bero

J. Electron. Packag. September 1995, 117(3): 249–254. doi: https://doi.org/10.1115/1.2792101

Abstract

View articletitled, A Rubbery Cure Shrinkage Model for Analyzing Encapsulated Assemblies

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Topics: Shrinkage (Materials) , Hardening (Curing) , Epoxy resins , Finite element analysis , Stress , Temperature , Constitutive equations , Cooling , Damage , Delamination

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Performance Analysis of a Brazed Plate Heat Exchanger during Condensation of R1233zd(E)

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Technical Papers

Non-Fourier Heat Conduction in IC Chip

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging

A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate

Investigation of a Heat Pipe Array for Convective Cooling

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages

Study of Print Release Process in Solder Paste Printing

Application of Statistical Clustering to Screen Printing Process Control

Wetting Kinetics of Molten 60Sn40Pb on a Ag-0.33 wt.% Pt Thick Film Conductor

Technical Briefs

Numerical Studies of Non-Newtonian Channel Flow and Heat Transfer Enhancement for Electronics Modules

A Rubbery Cure Shrinkage Model for Analyzing Encapsulated Assemblies

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