Volume 126 Issue 4 | J. Electron. Packag.

Foreword

J. Electron. Packag. December 2004, 126(4): 409. doi: https://doi.org/10.1115/1.1827273

Topics: Heat sinks , Packaging , Thermal engineering , Thermal management , Cooling , Computer cooling , Computers , Inventions , Design , Heat transfer

Research Paper

Optimal Design for PPF Heat Sinks in Electronics Cooling Applications

Han-Ting Chen, Jenn-Tsong Horng, Po-Li Chen, Ying-Huei Hung

J. Electron. Packag. December 2004, 126(4): 410–422. doi: https://doi.org/10.1115/1.1826078

Abstract

View articletitled, Optimal Design for PPF Heat Sinks in Electronics Cooling Applications

Open the PDF for in another window

Topics: Design , Heat sinks , Optimization

Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

Yoji Kitamura, Masaru Ishizuka

J. Electron. Packag. December 2004, 126(4): 423–428. doi: https://doi.org/10.1115/1.1827256

Abstract

View articletitled, Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

Open the PDF for in another window

Topics: Cooling , Electronic equipment , Temperature , Natural convection , Flow (Dynamics) , Computer simulation

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause

J. Electron. Packag. December 2004, 126(4): 429–434. doi: https://doi.org/10.1115/1.1827257

Abstract

View articletitled, Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

Open the PDF for in another window

Topics: Heat , Junctions , Optimization , Solders , Temperature , Thermal conductivity , Thermal resistance , Epoxy adhesives , Epoxy resins , Numerical analysis

Thermal Model of a Thinned-Die Cooling System

N. Boiadjieva, P. Koev

J. Electron. Packag. December 2004, 126(4): 435–439. doi: https://doi.org/10.1115/1.1826079

Abstract

View articletitled, Thermal Model of a Thinned-Die Cooling System

Open the PDF for in another window

Topics: Air flow , Cooling systems , Flat heat pipes , Flow (Dynamics) , Heat exchangers , Temperature , Cooling , Heat , Silicon

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

Wataru Nakayama, Ryuichi Matsuki, Yukari Hacho, Kiyoko Yajima

J. Electron. Packag. December 2004, 126(4): 440–448. doi: https://doi.org/10.1115/1.1827259

Abstract

View articletitled, A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

Open the PDF for in another window

Topics: Computational fluid dynamics , Design , Electronic equipment , Simulation , Thermal analysis , Taguchi methods , Temperature , Thermal resistance

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,

J. Electron. Packag. December 2004, 126(4): 449–456. doi: https://doi.org/10.1115/1.1827260

Abstract

View articletitled, Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

Open the PDF for in another window

Topics: Flat heat pipes , Forced convection , Mixed convection , Natural convection , Printed circuit boards , Thermal conductivity , Thermal resistance , Heat transfer , Copper , Junctions

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Brian H. Dennis, Zhen-xue Han, George S. Dulikravich

J. Electron. Packag. December 2004, 126(4): 457–464. doi: https://doi.org/10.1115/1.1827261

Abstract

View articletitled, Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Open the PDF for in another window

Topics: Ball-Grid-Array packaging , Boundary-value problems , Errors , Flux (Metallurgy) , Heat , Heat conduction , Temperature , Temperature distribution , Finite element analysis , Finite element methods

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Tunc Icoz, Yogesh Jaluria

J. Electron. Packag. December 2004, 126(4): 465–471. doi: https://doi.org/10.1115/1.1827262

Abstract

View articletitled, Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Open the PDF for in another window

Topics: Computer simulation , Cooling systems , Design , Electronic equipment , Flow (Dynamics) , Heat , Temperature , Turbulence , Cooling , Heat transfer

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair

J. Electron. Packag. December 2004, 126(4): 472–476. doi: https://doi.org/10.1115/1.1827263

Abstract

View articletitled, Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

Open the PDF for in another window

Topics: Capacitance , Computer cooling , Heat , Junctions , Linear systems , Simulation , Steady state , Temperature , Topology , Transients (Dynamics)

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

M. Herna´ndez-Mora, J. E. Gonza´lez, M. Ve´lez-Reyes, J. M. Ortiz-Rodrı´guez, Y. Pang, E. Scott

J. Electron. Packag. December 2004, 126(4): 477–490. doi: https://doi.org/10.1115/1.1827264

Abstract

View articletitled, Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

Open the PDF for in another window

Topics: Capacitance , Electronics , Heat transfer , Simulation , Temperature , Thermal analysis , Transients (Dynamics) , Computer software , Heat , Design

The Challenges of Electronic Cooling: Past, Current and Future

Richard C. Chu

J. Electron. Packag. December 2004, 126(4): 491–500. doi: https://doi.org/10.1115/1.1839594

Abstract

View articletitled, The Challenges of Electronic Cooling: Past, Current and Future

Open the PDF for in another window

Topics: Cooling

$h_{adiabatic}$ and ${u_{max}}^{'}$

Robert J. Moffat

J. Electron. Packag. December 2004, 126(4): 501–509. doi: https://doi.org/10.1115/1.1827265

Abstract

View articletitled, <math xmlns="http://www.w3.org/1998/Math/MathML"><mrow xmlns=""><msub><mi>h</mi><mrow><mtext mathvariant="italic">adiabatic</mtext></mrow></msub></mrow></math> and <math xmlns="http://www.w3.org/1998/Math/MathML"><mrow xmlns=""><msup><msub><mi>u</mi><mrow><mo mathvariant="italic">max</mo></mrow></msub><mrow><mo>′</mo></mrow></msup></mrow></math>

Open the PDF for in another window

Topics: Computational fluid dynamics , Flow (Dynamics) , Heat transfer , Temperature , Turbulence , Heat transfer coefficients , Heat conduction , Heating , Coolants , Computer cooling

Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

Roger Schmidt, Ethan Cruz

J. Electron. Packag. December 2004, 126(4): 510–518. doi: https://doi.org/10.1115/1.1827266

Abstract

View articletitled, Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

Open the PDF for in another window

Topics: Data centers , Flow (Dynamics) , Temperature , Tiles , Computers

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Siddharth Bhopte, Musa S. Alshuqairi, Dereje Agonafer, Fellow ASME, Gamal Refai-Ahmed, Fellow ASME

J. Electron. Packag. December 2004, 126(4): 519–523. doi: https://doi.org/10.1115/1.1827267

Abstract

View articletitled, Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Open the PDF for in another window

Topics: Heat sinks , Mixed convection , Reynolds number , Nozzles , Cooling , Computer simulation , Heat , Flow (Dynamics) , Rayleigh number

Methodology for an Integrated (Electrical/Mechanical) Design of PWBA

Wonkee Ahn, Dereje Agonafer, Fellow ASME, Shlomo Novotny, Fellow ASME

J. Electron. Packag. December 2004, 126(4): 524–527. doi: https://doi.org/10.1115/1.1827268

Abstract

View articletitled, Methodology for an Integrated (Electrical/Mechanical) Design of PWBA

Open the PDF for in another window

Topics: Design , Mechanical computer-aided design , Printed circuit boards , Manufacturing

An Analytical Study of the Optimized Performance of an Impingement Heat Sink

S. B. Sathe, B. G. Sammakia

J. Electron. Packag. December 2004, 126(4): 528–534. doi: https://doi.org/10.1115/1.1827269

Abstract

View articletitled, An Analytical Study of the Optimized Performance of an Impingement Heat Sink

Open the PDF for in another window

Topics: Design , Flow (Dynamics) , Heat sinks , Pressure drop , Computation , Heat transfer , Fins

Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment

Gamal Refai-Ahmed, Fellow ASME, Stephanie Trottier

J. Electron. Packag. December 2004, 126(4): 535–540. doi: https://doi.org/10.1115/1.1773199

Abstract

View articletitled, Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment

Open the PDF for in another window

Topics: Cycles , Lasers , Pumps , Temperature , Thermal resistance

Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint

Y. C. Chan, M. O. Alam, K. C. Hung, H. Lu, C. Bailey

J. Electron. Packag. December 2004, 126(4): 541–545. doi: https://doi.org/10.1115/1.1756590

Abstract

View articletitled, Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint

Open the PDF for in another window

Topics: Bonding , Flip-chip , Flip-chip devices , Flow (Dynamics) , Reliability , Solder joints , Solders , Modeling

Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

C. P. Tso, K. W. Tou, H. Bhowmik

J. Electron. Packag. December 2004, 126(4): 546–553. doi: https://doi.org/10.1115/1.1827270

Abstract

View articletitled, Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

Open the PDF for in another window

Topics: Natural convection , Steady state , Transients (Dynamics) , Heat , Temperature , Flow (Dynamics) , Coolants , Water , Heat transfer , Pumps

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

Yasin Makwana, Dereje Agonafer, Fellow ASME, Dan Manole

J. Electron. Packag. December 2004, 126(4): 554–559. doi: https://doi.org/10.1115/1.1827272

Abstract

View articletitled, Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

Open the PDF for in another window

Topics: Compressors , Refrigeration , Temperature , Stress , Computers , Stability , Vapors , Valves

Technical Brief

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Tong Hong Wang, Yi-Shao Lai, Jenq-Dah Wu

J. Electron. Packag. December 2004, 126(4): 560–564. doi: https://doi.org/10.1115/1.1827271

Abstract

View articletitled, Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Open the PDF for in another window

Topics: Ball-Grid-Array packaging , Creep , Fatigue , Flip-chip , Materials properties , Reliability , Solders , Thermomechanics , Shear (Mechanics) , Finite element analysis

Technology Review

Highlights from the European Thermal Project PROFIT

Clemens J. M. Lasance

J. Electron. Packag. December 2004, 126(4): 565–570. doi: https://doi.org/10.1115/1.1827258

Abstract

View articletitled, Highlights from the European Thermal Project PROFIT

Open the PDF for in another window

Topics: Modeling , Reliability , Safety , Steady state , Temperature , Computer software , Electronic products , Temperature gradient

Foreword

Foreword

Research Paper

Optimal Design for PPF Heat Sinks in Electronics Cooling Applications

Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

Thermal Model of a Thinned-Die Cooling System

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

The Challenges of Electronic Cooling: Past, Current and Future

$h_{adiabatic}$ and ${u_{max}}^{'}$

Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Methodology for an Integrated (Electrical/Mechanical) Design of PWBA

An Analytical Study of the Optimized Performance of an Impingement Heat Sink

Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment

Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint

Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

Technical Brief

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Technology Review

Highlights from the European Thermal Project PROFIT

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Issues

Foreword

Research Paper

Technical Brief

Technology Review

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only