Topics: Fillers (Materials) , Flip-chip devices , Flow (Dynamics) , Reliability , Resins , Semiconductor wafers , Flip-chip , Thermal expansion , Epoxy resins , Solder joints

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik, Suk-Jin Ham, Soon-Bok Lee, Member ASME

J. Electron. Packag. June 2005, 127(2): 86–90. doi: https://doi.org/10.1115/1.1846062

Abstract

View articletitled, Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

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Topics: Acoustics , Adhesives , Anisotropy , Deformation , Delamination , Flip-chip devices , Interferometry , Microscopy , Reliability , Thermal deformation

Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications

Andrzej Mościcki, Jan Felba, Tadeusz Sobierajski, Józef Kudzia

J. Electron. Packag. June 2005, 127(2): 91–95. doi: https://doi.org/10.1115/1.1899165

Abstract

View articletitled, Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications

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Topics: Adhesives , Hardening (Curing) , Fillers (Materials)

Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)

John Lau, ASME Fellow, Walter Dauksher

J. Electron. Packag. June 2005, 127(2): 96–105. doi: https://doi.org/10.1115/1.1846069

Abstract

View articletitled, Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)

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Topics: Ceramics , Creep , Cycles , Lead-free solders , Reliability , Solders , Temperature , Printed circuit boards , Fatigue , Weibull distribution

Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins

Y. S. Chung, D. H. Lee, P. M. Ligrani

J. Electron. Packag. June 2005, 127(2): 106–112. doi: https://doi.org/10.1115/1.1849235

Abstract

View articletitled, Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins

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Topics: Flat plates , Flow (Dynamics) , Flow visualization , Nozzles , Pressure , Liquid crystals , Temperature distribution , Fins , Jets , Testing

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

W. K. Chiang, Y. C. Chan

J. Electron. Packag. June 2005, 127(2): 113–119. doi: https://doi.org/10.1115/1.1849236

Abstract

View articletitled, Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

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Topics: Contact resistance , Reflow soldering , Reliability , Bonding , Adhesives , Temperature , Anisotropy , Testing

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Daijiao Wang, Ronald L. Panton

J. Electron. Packag. June 2005, 127(2): 120–126. doi: https://doi.org/10.1115/1.1876472

Abstract

View articletitled, Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

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Topics: Cooling , Flip-chip assemblies , Heating , Melting , Solder joints , Solders , Temperature , Bubbles , Flow (Dynamics) , Reliability

Performance of Graphite Foam Evaporator for Use in Thermal Management

Johnathan S. Coursey, Jungho Kim, Paul J. Boudreaux

J. Electron. Packag. June 2005, 127(2): 127–134. doi: https://doi.org/10.1115/1.1871193

Abstract

View articletitled, Performance of Graphite Foam Evaporator for Use in Thermal Management

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Topics: Boiling , Copper , Density , Graphite , Temperature , Thermal management , Heat transfer , Condensers (steam plant) , Fluids , Thermal conductivity

Submodeling Analysis for Path-Dependent Thermomechanical Problems

Tong Hong Wang, Yi-Shao Lai

J. Electron. Packag. June 2005, 127(2): 135–140. doi: https://doi.org/10.1115/1.1869513

Abstract

View articletitled, Submodeling Analysis for Path-Dependent Thermomechanical Problems

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Topics: Fatigue , Fatigue life , Finite element analysis , Solders , Stress , Thermomechanics , Strips , Electronic packages

An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems

Kazuyoshi Fushinobu, Masashi Nakata

J. Electron. Packag. June 2005, 127(2): 141–146. doi: https://doi.org/10.1115/1.1869511

Abstract

View articletitled, An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems

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Topics: Electroosmosis , Flow (Dynamics) , Manufacturing , Microchannels , Microelectromechanical systems , Microfluidics

Yield Function for Solder Elastoviscoplastic Modeling

M. Dube, T. Kundu

J. Electron. Packag. June 2005, 127(2): 147–156. doi: https://doi.org/10.1115/1.1869514

Abstract

View articletitled, Yield Function for Solder Elastoviscoplastic Modeling

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Topics: Modeling , Solders , Temperature , Simulation , Stress

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

C. Basaran, H. Ye, D. C. Hopkins, D. Frear, J. K. Lin

J. Electron. Packag. June 2005, 127(2): 157–163. doi: https://doi.org/10.1115/1.1898338

Abstract

View articletitled, Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

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Topics: Current density , Electrodiffusion , Failure , Flip-chip , Flip-chip devices , Solder joints , Failure mechanisms , Nucleation (Physics)

Hygrothermal Cracking Analysis of Plastic IC Package

Ji Hyuck Yang, Kang Yong Lee

J. Electron. Packag. June 2005, 127(2): 164–171. doi: https://doi.org/10.1115/1.1870016

Abstract

View articletitled, Hygrothermal Cracking Analysis of Plastic IC Package

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Topics: Delamination , Fracture (Materials) , Fracture (Process) , Fracture mechanics , High temperature , Reflow soldering , Vapor pressure , Viscoelasticity , Low temperature , Design

Design and Thermal Characteristics of a Synthetic Jet Ejector Heat Sink

Raghav Mahalingam, Ari Glezer

J. Electron. Packag. June 2005, 127(2): 172–177. doi: https://doi.org/10.1115/1.1869509

Abstract

View articletitled, Design and Thermal Characteristics of a Synthetic Jet Ejector Heat Sink

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Topics: Ejectors , Heat sinks , Flow (Dynamics) , Jets , Design , Thermal resistance , Temperature

Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects

J. Cepeda-Rizo, Hsien-Yang Yeh, N. Teneketges

J. Electron. Packag. June 2005, 127(2): 178–184. doi: https://doi.org/10.1115/1.1898339

Abstract

View articletitled, Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects

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Topics: Laminates , Printed circuit boards , Warping , Approximation , Sensors , Pressure , Displacement , Stress

Creep Prediction of a Printed Wiring Board For Separable Land Grid Array Connector

J. Cepeda-Rizo, Hsien-Yang Yeh

J. Electron. Packag. June 2005, 127(2): 185–188. doi: https://doi.org/10.1115/1.1899164

Abstract

View articletitled, Creep Prediction of a Printed Wiring Board For Separable Land Grid Array Connector

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Topics: Creep , Printed circuit boards , Temperature , Testing

Technical Brief

Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers

X. K. Sun, X. J. Xin, Z. J. Pei

J. Electron. Packag. June 2005, 127(2): 189–192. doi: https://doi.org/10.1115/1.1869510

Abstract

View articletitled, Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers

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Topics: Finite element analysis , Semiconductor wafers , Stress , Testing , Fracture (Materials)

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Research Papers

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Snap-Curing Electrically Conductive Formulation for Solder Replacement Applications

Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards)

Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

Experimental Study of Void Formation in High-Lead Solder Joints of Flip-Chip Assemblies

Performance of Graphite Foam Evaporator for Use in Thermal Management

Submodeling Analysis for Path-Dependent Thermomechanical Problems

An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems

Yield Function for Solder Elastoviscoplastic Modeling

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

Hygrothermal Cracking Analysis of Plastic IC Package

Design and Thermal Characteristics of a Synthetic Jet Ejector Heat Sink

Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects

Creep Prediction of a Printed Wiring Board For Separable Land Grid Array Connector

Technical Brief

Finite Element Analysis of Die-Strength Testing Configurations for Thin Wafers

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