Skip Nav Destination
Issues
June 2010
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and Correlation
J. Electron. Packag. June 2010, 132(2): 021001.
doi: https://doi.org/10.1115/1.4001590
Topics:
Blades
,
Chords (Trusses)
,
Fans
,
Flow (Dynamics)
,
Pressure
,
Scaling laws (Mathematical physics)
,
Cooling
,
Reynolds number
,
Design
Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center
J. Electron. Packag. June 2010, 132(2): 021002.
doi: https://doi.org/10.1115/1.4001589
Topics:
Computer simulation
,
Data centers
,
Flow (Dynamics)
,
Pipes
,
Tiles
,
Air flow
,
Modeling
,
Porosity
Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films
J. Electron. Packag. June 2010, 132(2): 021003.
doi: https://doi.org/10.1115/1.4001687
Topics:
Current density
,
Diffusion (Physics)
,
Electrodiffusion
,
Grain boundary diffusion
,
Grain size
,
Temperature
,
Sputtering (Irradiation)
,
Circuits
,
Damage
,
Strips
Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly
J. Electron. Packag. June 2010, 132(2): 021004.
doi: https://doi.org/10.1115/1.4001746
Topics:
Finite element analysis
,
Manufacturing
,
Model validation
,
Reliability
,
Temperature
,
Warping
,
Laminates
,
Weight (Mass)
,
Lasers
,
Thermomechanics
An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays
J. Electron. Packag. June 2010, 132(2): 021005.
doi: https://doi.org/10.1115/1.4001745
Topics:
Manufacturing
,
Pipes
,
Silicon
,
Testing
,
Thermal conductivity
,
Water
,
Temperature
,
Thermal resistance
Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System
J. Electron. Packag. June 2010, 132(2): 021006.
doi: https://doi.org/10.1115/1.4001832
Topics:
Cycles
,
Inspection
,
Lasers
,
Reliability
,
Solder joints
,
Ultrasound
,
X-rays
,
Fracture (Materials)
Singularities at Solder Joint Interfaces and Their Effects on Fracture Models
J. Electron. Packag. June 2010, 132(2): 021007.
doi: https://doi.org/10.1115/1.4001588
Topics:
Fracture (Materials)
,
Stress
,
Solder joints
,
Finite element analysis
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
J. Electron. Packag. June 2010, 132(2): 021008.
doi: https://doi.org/10.1115/1.4001852
Topics:
Junctions
,
Temperature
,
Pareto optimization
,
Delays
,
Temperature gradient
,
Engines
Data Center Housing High Performance Supercomputer Cluster: Above Floor Thermal Measurements Compared To CFD Analysis
J. Electron. Packag. June 2010, 132(2): 021009.
doi: https://doi.org/10.1115/1.4001871
Topics:
Computational fluid dynamics
,
Data centers
,
Temperature
,
Cooling
,
Air flow
Technical Briefs
Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers
J. Electron. Packag. June 2010, 132(2): 024501.
doi: https://doi.org/10.1115/1.4001831
Topics:
Cooling
,
Thermal management
,
Temperature
,
Heat sinks
,
Reliability
,
Thermoelectric coolers
,
Air flow
Email alerts
RSS Feeds
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
J. Electron. Packag (March 2025)
