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Issues
December 2019
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Review Article
Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging
J. Electron. Packag. December 2019, 141(4): 040801.
doi: https://doi.org/10.1115/1.4043341
Topics:
Packaging
,
Semiconductor wafers
,
Solders
,
Warping
,
Etching
A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint
J. Electron. Packag. December 2019, 141(4): 040802.
doi: https://doi.org/10.1115/1.4043405
Topics:
Creep
,
Cycles
,
Damage
,
Failure
,
Fatigue
,
Fatigue life
,
Solder joints
,
Stress
,
Fracture (Materials)
,
Solders
Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
J. Electron. Packag. December 2019, 141(4): 040803.
doi: https://doi.org/10.1115/1.4043404
Topics:
Cooling
,
Diamonds
,
Gallium nitride
,
Microfluidics
,
Transistors
,
Thermal conductivity
,
Temperature
,
Junctions
,
Heat
,
Thermal management
Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies
J. Electron. Packag. December 2019, 141(4): 040804.
doi: https://doi.org/10.1115/1.4044624
Topics:
Light-emitting diodes
,
Packaging
,
Ultraviolet radiation
Research Papers
Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages
Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham
J. Electron. Packag. December 2019, 141(4): 041001.
doi: https://doi.org/10.1115/1.4043406
Topics:
Cooling
,
Flow (Dynamics)
,
Heat
,
Heat sinks
,
Temperature
,
Geometry
,
Coolants
,
Fins
,
Silicon
,
Electronic packages
Investigation of the Mechanism of Temperature Rise in a Data Center With Cold Aisle Containment
J. Electron. Packag. December 2019, 141(4): 041002.
doi: https://doi.org/10.1115/1.4043157
Topics:
Containment
,
Data centers
,
Pressure
,
Temperature
,
Air flow
,
Flow (Dynamics)
Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
J. Electron. Packag. December 2019, 141(4): 041003.
doi: https://doi.org/10.1115/1.4043645
Topics:
Cements (Adhesives)
,
Ceramics
,
Dams
,
Manufacturing
,
Reliability
,
Shear strength
,
Low temperature
,
Molding
,
Temperature
,
Viscosity
Thermal Control Strategies for Reliable and Energy-Efficient Data Centers
J. Electron. Packag. December 2019, 141(4): 041004.
doi: https://doi.org/10.1115/1.4044129
Topics:
Cooling systems
,
Data centers
,
Energy consumption
,
Flow (Dynamics)
,
Reliability
,
Temperature
,
Energy efficiency
,
Simulation
,
Control equipment
Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers
J. Electron. Packag. December 2019, 141(4): 041005.
doi: https://doi.org/10.1115/1.4044130
Topics:
Computer simulation
,
Coolants
,
Cooling
,
Flow (Dynamics)
,
Pressure drop
,
Temperature
,
Thermal resistance
,
Heat
,
Heat transfer coefficients
,
Heat transfer
Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode Packaging
J. Electron. Packag. December 2019, 141(4): 041006.
doi: https://doi.org/10.1115/1.4044475
Topics:
Light-emitting diodes
,
Quantum dots
,
Packaging
,
Absorption
,
Light sources
Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses
J. Electron. Packag. December 2019, 141(4): 041007.
doi: https://doi.org/10.1115/1.4044961
Topics:
Bending strength
,
Boundary-value problems
,
Displacement
,
Glass
,
Stress
,
Failure mechanisms
,
Surface roughness
Numerical Investigation of Shape Effect on Microdroplet Evaporation
J. Electron. Packag. December 2019, 141(4): 041008.
doi: https://doi.org/10.1115/1.4044962
Topics:
Diffusion (Physics)
,
Drops
,
Evaporation
,
Vapors
,
Shapes
,
Simulation
Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation
J. Electron. Packag. December 2019, 141(4): 041009.
doi: https://doi.org/10.1115/1.4044817
Topics:
Flip-chip
,
Flow (Dynamics)
,
Fluids
,
Pressure
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