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Issues
September 2020
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Guest Editorial
Special Issue on InterPACK 2019 – Part 1
J. Electron. Packag. September 2020, 142(3): 030301.
doi: https://doi.org/10.1115/1.4048039
Special Papers
High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting
J. Electron. Packag. September 2020, 142(3): 031101.
doi: https://doi.org/10.1115/1.4046763
Topics:
Coating processes
,
Coatings
,
Composite materials
,
Crystals
,
Density
,
Particulate matter
,
Phosphors
,
Power density
,
Lasers
,
Aluminum
Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications
Jun Wang, Yang Zhao, Han Chen, Yan Tang, Guozhen Liu, Renli Liang, Jiangnan Dai, Changqing Chen, Junyong Kang, Duanjun Cai
J. Electron. Packag. September 2020, 142(3): 031102.
doi: https://doi.org/10.1115/1.4046764
Surface Current Improvement of Magnesium-Doped Hexagonal Boron Nitride Monolayer by Additional Nitrogen Gas Flow
Yuejin Wang, Guozhen Liu, Shiqiang Lu, Bin Guo, Hongye Zhang, Fuchun Xu, Xiaohong Chen, Duanjun Cai, Junyong Kang
J. Electron. Packag. September 2020, 142(3): 031103.
doi: https://doi.org/10.1115/1.4046765
Topics:
Boron
,
Gas flow
,
Magnesium (Metal)
,
Nitrogen
,
Thermal conductivity
,
Optoelectronic devices
The Optical Properties of Dual-Wavelength InxGa1−xN/GaN Nanorods for Wide-Spectrum Light-Emitting Diodes
J. Electron. Packag. September 2020, 142(3): 031104.
doi: https://doi.org/10.1115/1.4046766
Topics:
Gallium nitride
,
Light-emitting diodes
,
Nanorods
,
Wavelength
,
Emissions
,
Temperature
Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence
J. Electron. Packag. September 2020, 142(3): 031105.
doi: https://doi.org/10.1115/1.4046767
Topics:
Evaporation
,
Fluorescence
,
Temperature
,
Vapors
,
Microscale devices
Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach
J. Electron. Packag. September 2020, 142(3): 031106.
doi: https://doi.org/10.1115/1.4046848
Topics:
Bonding
,
Columns (Structural)
,
Copper
,
Design
,
Gates (Closures)
,
Manufacturing
,
Modeling
,
Semiconductor wafers
,
Silicon
,
Tiles
Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink
J. Electron. Packag. September 2020, 142(3): 031107.
doi: https://doi.org/10.1115/1.4046849
Topics:
Circuits
,
Damage
,
Electrodiffusion
,
Failure analysis
,
Flexible electronics
,
Inks
,
Metals
,
Nanoparticles
,
Reliability
,
Density
Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region
J. Electron. Packag. September 2020, 142(3): 031108.
doi: https://doi.org/10.1115/1.4046934
Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
J. Electron. Packag. September 2020, 142(3): 031109.
doi: https://doi.org/10.1115/1.4046935
Topics:
Electrical properties
,
Electronics
,
Iron
,
Nanocomposites
,
Nanoparticles
,
Phase change materials
,
Temperature
,
Thermal conductivity
,
Thermal properties
,
Heat
Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles
J. Electron. Packag. September 2020, 142(3): 031110.
doi: https://doi.org/10.1115/1.4047063
Topics:
Cycles
,
Melting
,
Metals
,
Solidification
,
Temperature
,
Alloys
,
Stability
Characterization of the Interdependence Between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes
Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Hoyeon Kim, Noel C. Giebnik, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
J. Electron. Packag. September 2020, 142(3): 031111.
doi: https://doi.org/10.1115/1.4047015
Topics:
Gallium nitride
,
Heating
,
Light-emitting diodes
,
Nanoparticles
,
Temperature
,
Temperature measurement
,
Microscopy
Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
J. Electron. Packag. September 2020, 142(3): 031112.
doi: https://doi.org/10.1115/1.4047099
Topics:
Temperature
,
Testing
,
Thermal resistance
,
Thermomechanics
,
Failure
,
Pumps
,
Steady state
Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
James Spencer Lundh, Yiwen Song, Bikramjit Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Brianna A. Klein, Dustin Kendig, Hyungtak Kim, Sukwon Choi
J. Electron. Packag. September 2020, 142(3): 031113.
doi: https://doi.org/10.1115/1.4047100
Topics:
Dynamics (Mechanics)
,
Electronics
,
Energy gap
,
Gallium nitride
,
Heating
,
Imaging
,
Steady state
,
Temperature
,
Temperature measurement
,
Thermal characterization
Demonstration of a Compliant Microspring Array as a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
J. Electron. Packag. September 2020, 142(3): 031114.
doi: https://doi.org/10.1115/1.4047356
Topics:
Heat sinks
,
Polymers
,
Surface roughness
,
Pressure
,
Thermal conductivity
,
Thermal resistance
Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer
J. Electron. Packag. September 2020, 142(3): 031115.
doi: https://doi.org/10.1115/1.4047286
Topics:
Electrons
,
Light-emitting diodes
,
Leakage
Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements
J. Electron. Packag. September 2020, 142(3): 031116.
doi: https://doi.org/10.1115/1.4047845
Topics:
Air flow
,
Computational fluid dynamics
,
Cooling
,
Data centers
,
Flow (Dynamics)
,
Temperature
,
Tiles
,
Potential energy
,
Stress
,
Leakage
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
J. Electron. Packag. September 2020, 142(3): 031117.
doi: https://doi.org/10.1115/1.4047846
Topics:
Flow (Dynamics)
,
Fluids
,
Heat
,
Heat flux
,
Manifolds
,
Microchannels
,
Pressure drop
,
Temperature
,
Uncertainty
,
Cooling
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling
Ki Wook Jung, Sougata Hazra, Heungdong Kwon, Alisha Piazza, Edward Jih, Mehdi Asheghi, Man Prakash Gupta, Michael Degner, Kenneth E. Goodson
J. Electron. Packag. September 2020, 142(3): 031118.
doi: https://doi.org/10.1115/1.4047883
Topics:
Computational fluid dynamics
,
Design
,
Fluids
,
Manifolds
,
Microchannels
,
Pressure drop
,
Simulation
,
Coolers
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
J. Electron. Packag. September 2020, 142(3): 031119.
doi: https://doi.org/10.1115/1.4047847
Topics:
Coatings
,
Lasers
,
Manufacturing
,
Microcoolers
,
Micromachining
,
Silicon
,
Protective coatings
,
Bonding
,
Coating processes
,
Etching
Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
J. Electron. Packag. September 2020, 142(3): 031120.
doi: https://doi.org/10.1115/1.4046933
Topics:
Glass
,
Heat
,
Manufacturing
,
Solar energy
,
Solar radiation
,
Temperature
,
Testing
,
Simulation
,
Liquid crystals
,
Computational fluid dynamics
Flexure and Twist Test Reliability Assurance of Flexible Electronics
J. Electron. Packag. September 2020, 142(3): 031121.
doi: https://doi.org/10.1115/1.4047844
Topics:
Bending (Stress)
,
Cycles
,
Failure
,
Reliability
,
Sintering
,
Temperature
,
Inks
,
Flexible electronics
,
Testing
,
Printing
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Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag